Abstract: Various aspects include devices, systems, and methods for cooling electronic equipment immersed in an immersion coolant tank with a fluid delivery wand. The fluid delivery wand may include a coolant conduit and an aperture cover. The coolant conduit may extend from a support base of the immersion coolant tank. The coolant conduit may include a lumen configured to receive dielectric fluid, wherein the coolant conduit includes at least one conduit aperture extending through a sidewall of the coolant conduit. The aperture cover may be in sliding engagement with an outer surface of the sidewall of the coolant conduit. The aperture cover may be configured to selectively restrict flow of dielectric fluid through the at least one conduit aperture by sliding along the outer surface of the outer of the sidewall.

Abstract: Various aspects include devices, systems, and methods for cooling a heatsink of electronic equipment immersed in an immersion coolant tank with a coolant shroud. The coolant shroud includes side walls and a covering wall. The side walls mounted on a mounting surface within the immersion coolant tank and on which the heatsink is secured and at least one of the side walls includes a fluid port. The covering wall extends from and between the side walls, wherein the side walls and the covering wall together form a cooling chamber that receives the heatsink. The covering wall includes a fluid aperture separate from the fluid port, wherein dielectric fluid inside the cooling chamber is in fluid communication with dielectric fluid outside the cooling chamber via the fluid aperture. The fluid port is in fluid communication with a dielectric fluid pump disposed outside the cooling chamber.

Abstract: A method of operating a cooling system including at least two water cooling circuits, an analyzer/controller configured to analyze water in the at least two water cooling circuits and solenoid valves operably connected to the at least two water cooling circuits. The method comprising opening solenoid valves associated with a first water cooling circuit of the at least two water cooling circuits to allow cooling water to flow to the analyzer/controller, detecting if the cooling water comprises one or more impurities above one or more predetermined thresholds and treating the cooling water if the analyzer/cooler detects one or more impurities in the cooling water above one or more predetermined thresholds.

Abstract: A power distribution unit for a dielectric cooling system comprising a thermal cutoff or a float switch.

Abstract: A computing system includes one or more rack rows comprising one or more racks. The racks includes one or more tanks that hold liquid coolant for at least one of the one or more servers, and a liquid coolant to remove heat from at least one of the one or more servers. An aisle is provided next to a rack row or between two of the rack rows. The aisle includes a floor. The floor can be walked on by service personnel to access at least one of the one or more racks in at least one of the rows. Cooling components at least partially below the aisle move a liquid to remove heat from at least one of the servers in at least one of the racks. The racks, floor and cooling components may be fire-resistant.

Abstract: Apparatus, systems, and methods for efficiently cooling computing devices having heat-generating electronic components, such as, for example, independently operable servers, immersed in a dielectric liquid coolant in a tank.

Abstract: An apparatus for holding and cooling rack-mountable servers having heat-producing electronic components includes a tank, a volume of dielectric liquid coolant in the tank, mounting members that hold rack-mountable servers in the tank, one or more pumps, fluid velocity augmentations devices, and a liquid-to-liquid or liquid-to-refrigerant heat exchanger outside of the tank. The mounting members hold the rack-mountable servers in a vertical orientation within the tank such that the servers are commonly submersed in the volume of the dielectric liquid coolant.

Abstract: Embodiments that allow for the air cooling of disk drives associated with liquid cooled nodes are disclosed. A node for performing computing operations includes a frame, a power supply coupled to the |frame|[CB1], and one or more liquid coolant-submersible motherboard assemblies. The one or more motherboard assemblies are configured to operate when submersed in a liquid coolant. The motherboard assemblies are mounted on the frame with one or more spaces between. The spaces form one or more channels between the motherboard assemblies. The frame includes an opening on at least one end of the one or more channels.

Abstract: A computing system includes one or more rack rows comprising one or more racks. The racks includes one or more tanks that hold liquid coolant for at least one of the one or more servers, and a liquid coolant to remove heat from at least one of the one or more servers. An aisle is provided next to a rack row or between two of the rack rows. The aisle includes a floor. The floor can be walked on by service personnel to access at least one of the one or more racks in at least one of the rows. Cooling components at least partially below the aisle move a liquid to remove heat from at least one of the servers in at least one of the racks. The racks, floor and cooling components may be fire-resistant.

Abstract: A computing module includes one or more racks, one or more cooling components, and one or more power distribution components. The racks include one or more servers and one or more tanks that hold liquid coolant for the servers. The one or more cooling components move a liquid to remove heat from the servers. The one or more power distribution components supply power to the servers. The one or more racks, one or more cooling components, and one or more power distribution components are commonly coupled to one another to be movable as a unit.

Abstract: A node for performing computing operations includes a frame, a power supply coupled to the frame, and one or more liquid coolant-submersible motherboard assemblies. The one or more motherboard assemblies are configured to operate when submersed in a liquid coolant. The motherboard assemblies are mounted on the frame with one or more spaces between. The spaces form one or more channels between the motherboard assemblies. The frame includes an opening on at least one end of the one or more channels.

Abstract: Hard disk drives and computing systems to which they are connected are cooled by submerging the computing systems into a dielectric liquid coolant in a tank and by thermally coupling the hard disk drives to a heat conductive extension that is partly submerged into the coolant and partly out of the coolant. To keep the hard disks drives out of the coolant, they are mounted to the part of the heat conductive extension that is out of the coolant. In such a configuration, the hard disk drives are cooled through conduction of the heat from the hard disk drive to the coolant via the heat conductive extension. A pump may be used to move warmer coolant from the tank into a heat exchanger where the coolant is cooled and to move the cooled coolant back into the tank.

Abstract: Apparatus, systems, and methods for efficiently cooling computing devices having heat-generating electronic components, such as, for example, independently operable servers, immersed in a dielectric liquid coolant in a tank.