Abstract: A method and system is provided for treating waste generated from manufacturing operations including at least one of Printed Circuit Boards Fabrication (PCB FAB), General Metal Finishing (GMF), semiconductors manufacturing, chemical milling, and Physical Vapour Deposition (PVD). The method and system are used to create zero liquid discharge recycling.
Abstract: A method and system is provided for treating waste generated from manufacturing operations including at least one of Printed Circuit Boards Fabrication (PCB FAB), General Metal Finishing (GMF), semiconductors manufacturing, chemical milling, and Physical Vapour Deposition (PVD). The method and system are used to create zero liquid discharge recycling.
Abstract: A method, system and composition is described for treating waste generated from manufacturing operations including at least one of Printed Circuit Boards Fabrication (PCB FAB), General Metal Finishing (GMF), semiconductors manufacturing, chemical milling, and Physical Vapour Deposition (PVD). The method, system and composition are used to create zero liquid discharge recycling.
Abstract: A method, system and composition is described for treating waste generated from manufacturing operations including at least one of Printed Circuit Boards Fabrication (PCB FAB), General Metal Finishing (GMF), semiconductors manufacturing, chemical milling, and Physical Vapour Deposition (PVD). The method, system and composition are used to create zero liquid discharge recycling.
Abstract: A method and system is provided for treating waste generated from manufacturing operations including at least one of Printed Circuit Boards Fabrication (PCB FAB), General Metal Finishing (GMF), semiconductors manufacturing, chemical milling, and Physical Vapour Deposition (PVD). The method and system are used to create zero liquid discharge recycling.