Abstract: This substrate for power electronic components comprises a colaminated multilayer composite material containing at least one internal layer (8) made of a material having a thermal expansion coefficient chosen depending on the expansion coefficient of said components, and external layers (6, 7) made of a thermally conductive material covering on either side said internal layer and connected together by wells (P) made of a thermally conductive material, said wells being arranged in the internal layer. Each interior layer forms an insert localized in a zone for mounting the components so that the external layers extend laterally beyond the insert.

Abstract: A method for forming supports for use in electronic components. A plate of copper-based alloy including from 0.1 to 1.0% by weight nickel, and from 0.005 to 0.1% by weight of phosphorus is melted and cast. The alloy includes fine precipitates of nickel phosphides throughout the copper matrix. The plate is subjected to a series of deformation operations including, rolling and intermediate annealing at a temperature in the range of 400.degree. to 600.degree. C., with the annealing temperature being maintained for two to four hours, thereby maximizing the production of fine precipitates of nickel phosphides within the alloy. After alloy formation, the plate is coated with a layer of nickel, cut into a desired shape, and secured to an electronic component.

Abstract: A method for the in-line homogenization and recrystallization of a continuous casting product by providing a continuous casting product including an alloy having a plurality of phases therein disposed proximate to the surface of the product and forming a plurality of voids at least near the surface by superficially cold-working the product. The surface is homogenized by heat treating and substantially reducing at least one of the phases whereby a portion of the voids assist in accelerating the diffusion of a portion of the voids into the alloy.

Abstract: The invention concerns the continuous casting of metals such as alloys of copper and is directed to the type of apparatus that uses a graphite die having a mold passage in which the casting is shaped as it passes through the die. In that type of apparatus, the die is disposed between cooling elements that conduct heat away from the die to cause the hot metal to cool as it passes through the die and because the die has a tendency to bend away from the cooling elements, the apparatus employs clamps to inhibit separation of the die from the cooling elements. In the invention, means are provided to apply compressive force to the ends of the die to cause bending moments to be set up in the die that counteract the tendency of the die to bend away from the cooling elements. In the invention the die is made of two graphite plates of uniform thickness separated by graphite spacers which form a generally rectangular mold passaage.