Abstract: The present invention discloses a robot control method using a non-contact displacement sensor, and an apparatus thereof. The robot control method using a non-contact displacement sensor may comprise steps of: checking a normal position according to a robot's motion range through the non-contact displacement sensor installed horizontally to an end effector of the robot; measuring displacement with respect to the end effector to obtain displacement data when a product is transferred by the robot; obtaining vibration data through a vibration sensor coupled to the robot; checking whether an abnormal state exists using the obtained data; and transmitting an adjustment value to correct displacement distortion of the robot when the robot is confirmed to be in the abnormal state.

Abstract: The present invention relates to a method of controlling a wafer transfer robot using static electricity prediction, and the method includes acquiring, when a wafer is transported by an end effector of the wafer transfer robot, temperature and humidity data around the wafer from a temperature sensor and a humidity sensor of a static elimination system installed in a non-contact manner with the end effector of the transfer robot, predicting an electrostatic voltage by substituting the acquired data into a predetermined humidity-electrostatic voltage graph, calculating a static elimination time of the predicted electrostatic voltage, performing static elimination on the wafer during the calculated static elimination time, and adjusting a transfer speed of the transfer robot based on the calculated static elimination time.

Abstract: Proposed are a wafer wobbling detection method and a wafer wobbling detection system, the method and the system being applied to a semiconductor processing device that performs a process while a wafer is rotated. The method includes securing a wafer surface image such that a reflection image which is reflecting a fixture and which is positioned on a surface of a wafer is included in the wafer surface image and detecting wobbling by analyzing the reflection image in the secured image, the reflection image being moved due to wobbling. In the system, a photographed image of a rotating wafer is analyzed with machine vision, so that wafer wobbling may be detected during a process for the wafer is performed. In addition, such as stopping the device in real time when abnormal wobbling occurs may be performed since wafer wobbling may be detected while the process for the wafer is performed.