Patents Assigned to GSMA Systems, Inc.
  • Patent number: 5954909
    Abstract: Process of adhering conductors such as bare copper wire, copper wire with polymide insulation, and multistrand Kapton wrapped superconductors to mount structures such as a cylinder of arbitrary cross sections, a saddle support, or steel tubes using adhesive layers of material such as BONDALL 16-H, 3M-2090 and T-164. The adhesive layers are subject to b-staging before being used, where it is heated to a temperature of approximately 60-100.degree. C. for approximately 1/2 hour to approximately one hour. The support surface can optionally be grooved to allow for better wire placement and no wire slippage.
    Type: Grant
    Filed: February 28, 1997
    Date of Patent: September 21, 1999
    Assignee: GSMA Systems, Inc.
    Inventors: Daniel Davidsohn, Scott Lundy, Rainer Meinke, Gerald Stelzer, Mark W. Senti