Abstract: A tool adapted to facilitate the removal of elements such as pin grid arrays, pin grid array sockets, chip carriers, and chip carrier sockets which have been soldered into plated through holes or similar elements of printed wiring cards. A platform is provided mounting two pivotable arms which are used to grip onto the element to be removed while a number of spring loaded posts are compressed to provide connection to the printed wiring card on which the element to be removed is attached. The entire assembly is then placed in a high temperature environment causing the solder to melt at which time the compressed springs, associated with the posts, effectively expand withdrawing the element from the printed wiring card.