Abstract: The invention discloses an encapsulation structure with high density, multiple sided and exposed leads and method for manufacturing the same. The encapsulation structure includes a package, a die pad and a plurality of leads, wherein the die pad and the leads are disposed at a bottom of the package; bottom surfaces of the leads expose in a bottom surface of the package, and the leads extends towards multiple sides of the package until beyond the package; the package includes an integrated circuit provided on the die pad and connected with the leads, and a plastic package for packaging the integrated circuit, the die pad and the leads; a bottom surface of the die pad and the bottom surfaces of the leads are provided on the same horizontal plane; the leads comprise a first lead distant from the die pad.