Abstract: Provided is a gamepad. The gamepad includes a first main unit, a second main unit, and a connection plate. The first main unit includes a main unit body, an interface assembly, and a horizontally moving assembly. The interface assembly is disposed in the main unit body, where an end of the interface assembly passes through an opening of the main unit body and then is connectable to the device to be connected. The horizontally moving assembly includes a first resilient block and a first resilient member that are sequentially disposed along a first direction, where the first resilient block and the first resilient member are disposed in the main unit body, a first end of the first resilient block is connected to the interface assembly, and a second end of the first resilient block is connected to a first end of the first resilient member.

Abstract: Provided are a gamepad and a cooling method thereof, which relate to the technical field of electronic gaming devices. The gamepad includes a gamepad body, a cooling assembly, and a power interface. A main PCB and a cooling PCB that are selectively electrically connected to each other are disposed in the gamepad body, the gamepad does not include a power supply apparatus, and the main PCB is selectively electrically connected to an external electronic device. The cooling assembly is electrically connected to the cooling PCB.