Abstract: The disclosed embodiments include an organopolysiloxane composition, a preparation method therefor, and a semiconductor component. The shore hardness of the cured product thereof is greater than A30 and less than A65. The composition comprises: (A1) solid 3D organopolysiloxane having an R13SiO1/2 unit and an SiO4/2 unit; (A2) liquid straight-chain organopolysiloxane having an R13SiO1/2 unit and an R22SiO2/2 unit; the mixing viscosity of component (A1) and (A2) is between 6,000 and 20,000 mPa·s; (B) liquid straight-chain polyorganohydrosiloxane having an R33SiO1/2 unit and an R42SiO2/2 unit; (C) an organosiloxane tackifier in which one molecule has on average at least one epoxy group; (D) a hydrosilylation catalyst of a volume enough to promote the curing of the composition. The composition of the present invention and the cured semiconductor component thereof have good heat resistance, good adhesiveness with aluminum having a mirror finish and ceramic substrate, and good resistance to humidity.
Type:
Grant
Filed:
January 23, 2015
Date of Patent:
September 4, 2018
Assignee:
GUANGZHOU HUMAN CHEM CO., LTD.
Inventors:
Haiting Zheng, Hai He, Jingwei Zhu, Guangyan Huang
Abstract: A curable organopolysiloxane composition and a semiconductor device are described. In a cured state and under conditions that the temperature is 25° C. and the humidity is 60% RH, the composition has the tensile strength of 2 to 8 Mpa, the elongation at break of 35% to 100% and the index of refraction being equal to or greater than 1.45. The composition includes: (A) organopolysiloxane comprising an R13SiO1/2 unit, an R22SiO2/2 unit and an R3SiO3/2 unit; (B) branched polyorganohydrogensiloxane having the viscosity of 300 to 4000 mPa·s, wherein each molecule has on average at least three silicon-bonded hydrogen atoms and at least one aromatic group, and the content of the aromatic group is larger than 10 mol %; and (C) a hydrosilylation catalyst having the content capable of facilitating curing of the composition.
Type:
Grant
Filed:
January 23, 2015
Date of Patent:
May 8, 2018
Assignee:
GUANGZHOU HUMAN CHEM CO., LTD.
Inventors:
Hai He, Wang Chen, Haiting Zheng, Jingwei Zhu, Guangyan Huang
Abstract: A curable organopolysiloxane composition and a semiconductor device are described. In a cured state and under conditions that the temperature is 25° C. and the humidity is 60% RH, the composition has the tensile strength of 2 to 8 Mpa, the elongation at break of 35% to 100% and the index of refraction being equal to or greater than 1.45. The composition includes: (A) organopolysiloxane comprising an R13SiO1/2 unit, an R22SiO2/2 unit and an R3SiO3/2 unit; (B) branched polyorganohydrogensiloxane having the viscosity of 300 to 4000 mPa·s, wherein each molecule has on average at least three silicon-bonded hydrogen atoms and at least one aromatic group, and the content of the aromatic group is larger than 10 mol %; and (C) a hydrosilylation catalyst having the content capable of facilitating curing of the composition.
Type:
Application
Filed:
January 23, 2015
Publication date:
May 4, 2017
Applicant:
GUANGZHOU HUMAN CHEM CO., LTD.
Inventors:
Hai HE, Wang CHEN, Haiting ZHENG, Jingwei ZHU, Guangyan HUANG