Patents Assigned to Gun Ei Chemical Industry Co., LTD
  • Patent number: 10519598
    Abstract: Provided are a pitch-formation suppressor and the like which can be widely applied independently of the substance that causes a pitch and of the situation to generate a pitch in a paper manufacturing process, and which can effectively suppress and prevent the troubles due to the pitch, such as foreign spots and defects in a paper, breakage of a paper, and lowering of workability. This pitch-formation suppressor comprises an alkaline solution in which a phenol resin and/or a modified phenol resin is dissolved, or an acid solution in which a phenol resin and/or a modified phenol resin is dissolved.
    Type: Grant
    Filed: December 26, 2013
    Date of Patent: December 31, 2019
    Assignees: KURITA WATER INDUSTRIES LTD., GUN EI CHEMICAL INDUSTRY CO., LTD.
    Inventors: Satoshi Wada, Yuko Okusa, Chigusa Taguchi, Yukio Abe, Michiyasu Yamazaki
  • Publication number: 20160255891
    Abstract: A method of producing a material for protective garment includes step of sheet-forming activated carbon fiber sheet using activated carbon fibers in which a phenolic resin fiber is used as a precursor and a step of reinforcing the activated carbon fiber sheet by interweaving a thread onto the activated carbon fiber sheet.
    Type: Application
    Filed: March 4, 2015
    Publication date: September 8, 2016
    Applicant: Gun Ei Chemical Industry Co., Ltd.
    Inventors: Masaru KIMURA, Shinichi MURATA, Akiyuki KOJIMA
  • Publication number: 20150322629
    Abstract: Provided are a pitch-formation suppressor and the like which can be widely applied independently of the substance that causes a pitch and of the situation to generate a pitch in a paper manufacturing process, and which can effectively suppress and prevent the troubles due to the pitch, such as foreign spots and defects in a paper, breakage of a paper, and lowering of workability. This pitch-formation suppressor comprises an alkaline solution in which a phenol resin and/or a modified phenol resin is dissolved, or an acid solution in which a phenol resin and/or a modified phenol resin is dissolved.
    Type: Application
    Filed: December 26, 2013
    Publication date: November 12, 2015
    Applicants: Kurita Water Industries Ltd., Gun Ei Chemical Industry Co., Ltd.
    Inventors: Satoshi WADA, Yuko OKUSA, Chigusa TAGUCHI, Yukio ABE, Michiyasu YAMAZAKI
  • Publication number: 20120241377
    Abstract: There is provided a water treatment method using a water treatment flocculant that suffers from minimal secondary contamination with flocculation residues and contains an alkaline solution of a phenolic resin. A water treatment method involving the addition of a flocculant to water to be treated and subsequent membrane separation treatment. The flocculant contains an alkaline solution of a phenolic resin having a melting point in the range of 130° C. to 220° C. The water treatment flocculant is produced by a resole-type second-order reaction in the presence of an alkaline catalyst in which an aldehyde is added to an alkali solution of a novolak phenolic resin. The novolak phenolic resin is produced by a reaction between a phenol and an aldehyde in the presence of an acid catalyst.
    Type: Application
    Filed: August 5, 2010
    Publication date: September 27, 2012
    Applicants: GUN EI CHEMICAL INDUSTRY CO., LTD., KURITA WATER INDUSTRIES LTD.
    Inventors: Yasuhiro Ooi, Keijirou Tada, Yukio Abe, Takeshi Iizuka, Satoru Kitano
  • Patent number: 7267876
    Abstract: The resin-coated sand is produced by coating the surface of a refractory granular aggregate with a thermosetting resin and a thermoplastic resin. When using this resin-coated sand, a mold with a less rough surface can be produced by a RP molding apparatus. When using this mold made of the resin-coated sand, a casting with fewer gas defects can be produced.
    Type: Grant
    Filed: March 31, 2004
    Date of Patent: September 11, 2007
    Assignee: Gun Ei Chemical Industry Co., Ltd.
    Inventors: Akihiro Okubo, Tatsunosuke Murakami, Fumitoshi Takeuchi, Koki Shiduka
  • Publication number: 20060284346
    Abstract: The resin-coated sand is produced by coating the surface of a refractory granular aggregate with a thermosetting resin and a thermoplastic resin. When using this resin-coated sand, a mold with a less rough surface can be produced by a RP molding apparatus. When using this mold made of the resin-coated sand, a casting with fewer gas defects can be produced.
    Type: Application
    Filed: August 11, 2006
    Publication date: December 21, 2006
    Applicant: GUN EI CHEMICAL INDUSTRY CO., LTD.
    Inventors: Akihiro Okubo, Tatsunosuke Murakami, Fumitoshi Takeuchi, Koki Shiduka
  • Patent number: 7087799
    Abstract: An object of the present invention is to provide a material which resolves the drawbacks associated with polyimide polymers, and yet retains the advantages offered by conventional polyimide polymers. An amino group containing phenol derivative of the present invention is represented by a general formula (1) show below, and the present invention also provides a polyimide precursor produced using such an amino group containing phenol derivative. (wherein, R1, R2 and R3, which may be the same or different, each represent an alkyl group of 1 to 9 carbon atoms, an alkoxy group of 1 to 10 carbon atoms, a COOR group (in which R represents an alkyl group of 1 to 6 carbon atoms) or a hydrogen atom; R4 and R5, which may be the same or different, each represent an alkyl group of 1 to 9 carbon atoms or a hydrogen atom; X represents —O—, —S—, —SO2—, —C(CH3)2—, —CH2—, —C(CH3)(C2H5)—, or —C(CF3)2—; and n represents an integer of 1 or greater).
    Type: Grant
    Filed: January 31, 2003
    Date of Patent: August 8, 2006
    Assignee: Gun Ei Chemical Industry Co., Ltd.
    Inventors: Takeshi Tsuihiji, Michiyasu Yamazaki
  • Patent number: 7019045
    Abstract: An object of the present invention is to provide a material which resolves the drawbacks associated with polyimide polymers, and yet retains the advantages offered by conventional polyimide polymers. An amino group containing phenol derivative of the present invention is represented by a general formula (1) show below, and the present invention also provides a polyimide precursor produced using such an amino group containing phenol derivative. (wherein, R1, R2 and R3, which may be the same or different, each represent an alkyl group of 1 to 9 carbon atoms, an alkoxy group of 1 to 10 carbon atoms, a COOR group (in which R represents an alkyl group of 1 to 6 carbon atoms) or a hydrogen atom; R4 and R5, which may be the same or different, each represent an alkyl group of 1 to 9 carbon atoms or a hydrogen atom; X represents —O—, —S—, —SO2—, —C(CH3)2—, —CH2—, —C(CH3)(C2H5)—, or —C(CF3)2—; and n represents an integer of 1 or greater).
    Type: Grant
    Filed: May 9, 2005
    Date of Patent: March 28, 2006
    Assignee: Gun Ei Chemical Industry Co., Ltd.
    Inventors: Takeshi Tsuihiji, Michiyasu Yamazaki
  • Publication number: 20050197482
    Abstract: An object of the present invention is to provide a material which resolves the drawbacks associated with polyimide polymers, and yet retains the advantages offered by conventional polyimide polymers. An amino group containing phenol derivative of the present invention is represented by a general formula (1) show below, and the present invention also provides a polyimide precursor produced using such an amino group containing phenol derivative. (wherein, R1, R2 and R3, which may be the same or different, each represent an alkyl group of 1 to 9 carbon atoms, an alkoxy group of 1 to 10 carbon atoms, a COOR group (in which R represents an alkyl group of 1 to 6 carbon atoms) or a hydrogen atom; R4 and R5, which may be the same or different, each represent an alkyl group of 1 to 9 carbon atoms or a hydrogen atom; X represents —O—, —S—, —SO2—, —C(CH3)2—, —CH2—, —C(CH3)(C2H5)—, or —C(CF3)2—; and n represents an integer of 1 or greater).
    Type: Application
    Filed: May 9, 2005
    Publication date: September 8, 2005
    Applicant: Gun Ei Chemical Industry Co., Ltd.
    Inventors: Takeshi Tsuihiji, Michiyasu Yamazaki
  • Publication number: 20040197558
    Abstract: The resin-coated sand is produced by coating the surface of a refractory granular aggregate with a thermosetting resin and a thermoplastic resin. When using this resin-coated sand, a mold with a less rough surface can be produced by a RP molding apparatus. When using this mold made of the resin-coated sand, a casting with fewer gas defects can be produced.
    Type: Application
    Filed: March 31, 2004
    Publication date: October 7, 2004
    Applicant: Gun Ei Chemical Industry Co., Ltd.
    Inventors: Akihiro Okubo, Tatsunosuke Murakami, Fumitoshi Takeuchi, Koki Shiduka
  • Patent number: 6653418
    Abstract: There is provided a process for preparing a polymer compound for a resist, which can improve the performance, such as the heat resistance, sensitivity and resolution of the resist, without causing film loss of the resist, line width reduction of the resist or deterioration of the dry etching resistance of the polymer. This process comprises dissolving a styrene-based monomer containing at least a 4-acetoxystyrene monomer, and a dimethyl-2,2′-azobiscarboxylate ester in a solvent, thereby to polymerize the styrene-based monomer; adding an alkali catalyst to the resulting polymer solution, thereby to hydrolyze the polymer solution; and washing the resulting polymer compound with water.
    Type: Grant
    Filed: August 16, 2002
    Date of Patent: November 25, 2003
    Assignee: Gun EI Chemical Industry Co., Ltd.
    Inventors: Katsuhiro Maruyama, Satoru Yoshida, Satoru Kitano, Hitoshi Mashio
  • Publication number: 20030215734
    Abstract: An object of the present invention is to provide a material which resolves the drawbacks associated with polyimide polymers, and yet retains the advantages offered by conventional polyimide polymers.
    Type: Application
    Filed: January 31, 2003
    Publication date: November 20, 2003
    Applicant: Gun Ei Chemical Industry Co., Ltd.
    Inventors: Takeshi Tsuihiji, Michiyasu Yamazaki
  • Patent number: 6242533
    Abstract: The present invention relates to a novolak type phenol resin, in particular a novolak type phenol resin for resists suitable for forming resist patterns. The novolak type phenol resin of the present invention is obtained by reacting at least a vinylphenol having a vinyl group and a phenolic hydroxyl group, such as parahydroxystyrene, or a polyvinylphenol, which is a polymer of the vinylphenol, a compound (A) such as 4,4′-methylenebis(2-hydroxymethyl-3,6-dimethylphenol) and/or a compound (B) such as 2,6-dihydroxymethyl-4-phenol, in a ratio of 1 to 40 moles of the compound (A) and/or compound (B) to 100 moles of the vinylphenol or 100 moles of structural unit of the vinylphenol contained in the polyvinylphenol in the presence of an acid and having a weight average molecular weight of 2,000 to 20,000. Such a novolak type phenol resin provides good pattern shape, heat resistance, resolution, and sensitivity in resists for lithography.
    Type: Grant
    Filed: May 31, 2000
    Date of Patent: June 5, 2001
    Assignee: Gun Ei Chemical Industry Co., Ltd.
    Inventors: Yoshiaki Kurimoto, Katsuhiro Maruyama, Akira Yoshitomo, Satoru Yoshida, Satoru Kitano
  • Patent number: 6211328
    Abstract: The present invention relates to a phenol resin, in particular a phenol resin for resists suitable for forming resist patterns. The phenol resin of the present invention is obtained by reacting at least two components, i.e., a compound (A) such as 4-hydroxymethyl-2,6-dimethylphenol and a polymerizable phenol compound such as parahydroxystyrene or a polymer (B), which is a polymer of the polymerizable phenol compound, in a ratio of 1 to 50 moles of the compound (A) to 100 moles of the polymerizable phenol compound or 100 moles of structural unit of the polymerizable phenol compound contained in the polymer (B) in the presence of an acid and having a molecular weight of 2,000 to 20,000. Such a phenol resin provides good pattern shape, heat resistance, resolution, and sensitivity in resists for lithography.
    Type: Grant
    Filed: June 1, 2000
    Date of Patent: April 3, 2001
    Assignee: Gun Ei Chemical Industry Co., LTD
    Inventors: Yoshiaki Kurimoto, Katsuhiro Maruyama, Akira Yoshitomo, Satoru Yoshida, Satoru Kitano
  • Patent number: 6124420
    Abstract: This invention provides a novolak type epoxy resin which has low melt viscosity but shows high heat resistance when hardened. Particularly, it relates to a novolak type epoxy resin in which the relationship between the total % by weight of 3 to 6 nucleus bodies and the melt viscosity measured by a cone plate method at 150.degree. C. satisfies specified conditions, an epoxy resin composition containing the same and hardened products thereof.
    Type: Grant
    Filed: December 5, 1997
    Date of Patent: September 26, 2000
    Assignees: Nippon Kayaku Kabushiki Kaisha, Gun Ei Chemical Industry Co., Ltd.
    Inventors: Kenichi Kuboki, Yoshio Shimamura, Ryoichi Hasegawa, Yoshiaki Kurimoto, Akiyuki Kojima, Yukio Abe
  • Patent number: 6001949
    Abstract: One of the objects of the present invention is to offer novolak type phenolic resins which use phenols and aldehydes as raw materials and give narrow molecular weight distributions.The novolak type phenolic resins of the present invention are those obtained by condensation reaction of phenols with aldehydes in the presence of an oxycarboxylic acid having carboxyl groups, --COOH, and alcoholic hydroxyl groups, --OH, in one molecule. Thus obtained novolak type phenolic resins show narrow molecular weight distributions, lower viscosity in molten state and, as a consequence, uniformity in curing time.
    Type: Grant
    Filed: December 13, 1995
    Date of Patent: December 14, 1999
    Assignee: Gun Ei Chemical Industry Co., Ltd.
    Inventors: Yoshiaki Kurimoto, Akiyuki Kojima, Yukio Abe, Tsuyoshi Fukuda, Kaori Hasegawa
  • Patent number: 5929191
    Abstract: One of the objects of the present invention is to offer novolak type phenolic resins which use phenols and aldehydes as raw materials and give narrow molecular weight distributions.The novolak type phenolic resins of the present invention are those obtained by condensation reaction of phenols with aldehydes in the presence of an oxycarboxylic acid having carboxyl groups, --COOH, and alcoholic hydroxyl groups, --OH, in one molecule. Thus, obtained novolak type phenolic resins show narrow molecular weight distributions, lower viscosity in molten state and, as a consequence, uniformity in curing time.
    Type: Grant
    Filed: May 27, 1997
    Date of Patent: July 27, 1999
    Assignee: Gun Ei Chemical Industry Co., Ltd.
    Inventors: Yoshiaki Kurimoto, Akiyuki Kojima, Yukio Abe, Tsuyoshi Fukuda, Kaori Hasegawa
  • Patent number: 5859168
    Abstract: One of the objects of the present invention is to offer novolak type phenolic resins which use phenols and aldehydes as raw materials and give narrow molecular weight distributions.The novolak type phenolic resins of the present invention are those obtained by condensation reaction of phenols with aldehydes in the presence of an oxycarboxylic acid having carboxyl groups, --COOH, and alcoholic hydroxyl groups, --OH, in one molecule. Thus obtained novolak type phenolic resins show narrow molecular weight distributions, lower viscosity in molten state and, as a consequence, uniformity in curing time.
    Type: Grant
    Filed: November 22, 1996
    Date of Patent: January 12, 1999
    Assignee: Gun Ei Chemical Industry Co., Ltd.
    Inventors: Yoshiaki Kurimoto, Akiyuki Kojima, Yukio Abe, Tsuyoshi Fukuda, Kaori Hasegawa
  • Patent number: 5545458
    Abstract: A foamed phenolic molding composed of a core made of a kraft paper honey comb structure consisting of plate and corrugate members impregnated with a phenolic resin; and expandable phenolic composites laminated to said core, wherein the expandable phenolic composites are made of a matted fiber material formed in the shape of a plate to which phenolic resin is bonded to at least one thereof. The expandable phenolic composites and core are molded such that the expandable phenolic material fills the cells of the kraft paper honey comb structure. The molding has excellent thermal insulation and sound insulating properties as well as high strength as compared to conventional cores without sacrificing to the lightweight characteristics and workability of the quadratic surfaces.
    Type: Grant
    Filed: August 29, 1994
    Date of Patent: August 13, 1996
    Assignees: Kawasaki Heavy Industries, Ltd., Gun-Ei Chemical Industry Co., Ltd., Nippon Techma Engineering Corp.
    Inventors: Saburo Fukushima, Masaharu Yagi, Kiyozi Morita, Masami Ando, Tokuo Saito
  • Patent number: 5230960
    Abstract: An activated and heat-treated product of a pitch fiber (A) is combined with an activated and heat-treated product of a precursor fiber of carbon fiber (B) having a larger elongation and a larger shrinkage during activation treatment thereof than those of the pitch fiber (A) to provide an activated carbon fiber structure. The activated carbon fiber structure is produced by subjecting the pitch fiber (A) and the precursor fiber of carbon fiber (B) to an activation treatment before or after the fibers (A) and (B) are formed into a configuration corresponding to a fiber structure through mixing or laminating.
    Type: Grant
    Filed: January 7, 1991
    Date of Patent: July 27, 1993
    Assignee: Gun Ei Chemical Industry Co., Ltd.
    Inventor: Toshi Iizuka