Patents Assigned to Gun Ei Chemical Industry Co., LTD
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Patent number: 10519598Abstract: Provided are a pitch-formation suppressor and the like which can be widely applied independently of the substance that causes a pitch and of the situation to generate a pitch in a paper manufacturing process, and which can effectively suppress and prevent the troubles due to the pitch, such as foreign spots and defects in a paper, breakage of a paper, and lowering of workability. This pitch-formation suppressor comprises an alkaline solution in which a phenol resin and/or a modified phenol resin is dissolved, or an acid solution in which a phenol resin and/or a modified phenol resin is dissolved.Type: GrantFiled: December 26, 2013Date of Patent: December 31, 2019Assignees: KURITA WATER INDUSTRIES LTD., GUN EI CHEMICAL INDUSTRY CO., LTD.Inventors: Satoshi Wada, Yuko Okusa, Chigusa Taguchi, Yukio Abe, Michiyasu Yamazaki
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Publication number: 20160255891Abstract: A method of producing a material for protective garment includes step of sheet-forming activated carbon fiber sheet using activated carbon fibers in which a phenolic resin fiber is used as a precursor and a step of reinforcing the activated carbon fiber sheet by interweaving a thread onto the activated carbon fiber sheet.Type: ApplicationFiled: March 4, 2015Publication date: September 8, 2016Applicant: Gun Ei Chemical Industry Co., Ltd.Inventors: Masaru KIMURA, Shinichi MURATA, Akiyuki KOJIMA
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Publication number: 20150322629Abstract: Provided are a pitch-formation suppressor and the like which can be widely applied independently of the substance that causes a pitch and of the situation to generate a pitch in a paper manufacturing process, and which can effectively suppress and prevent the troubles due to the pitch, such as foreign spots and defects in a paper, breakage of a paper, and lowering of workability. This pitch-formation suppressor comprises an alkaline solution in which a phenol resin and/or a modified phenol resin is dissolved, or an acid solution in which a phenol resin and/or a modified phenol resin is dissolved.Type: ApplicationFiled: December 26, 2013Publication date: November 12, 2015Applicants: Kurita Water Industries Ltd., Gun Ei Chemical Industry Co., Ltd.Inventors: Satoshi WADA, Yuko OKUSA, Chigusa TAGUCHI, Yukio ABE, Michiyasu YAMAZAKI
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Publication number: 20120241377Abstract: There is provided a water treatment method using a water treatment flocculant that suffers from minimal secondary contamination with flocculation residues and contains an alkaline solution of a phenolic resin. A water treatment method involving the addition of a flocculant to water to be treated and subsequent membrane separation treatment. The flocculant contains an alkaline solution of a phenolic resin having a melting point in the range of 130° C. to 220° C. The water treatment flocculant is produced by a resole-type second-order reaction in the presence of an alkaline catalyst in which an aldehyde is added to an alkali solution of a novolak phenolic resin. The novolak phenolic resin is produced by a reaction between a phenol and an aldehyde in the presence of an acid catalyst.Type: ApplicationFiled: August 5, 2010Publication date: September 27, 2012Applicants: GUN EI CHEMICAL INDUSTRY CO., LTD., KURITA WATER INDUSTRIES LTD.Inventors: Yasuhiro Ooi, Keijirou Tada, Yukio Abe, Takeshi Iizuka, Satoru Kitano
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Patent number: 7267876Abstract: The resin-coated sand is produced by coating the surface of a refractory granular aggregate with a thermosetting resin and a thermoplastic resin. When using this resin-coated sand, a mold with a less rough surface can be produced by a RP molding apparatus. When using this mold made of the resin-coated sand, a casting with fewer gas defects can be produced.Type: GrantFiled: March 31, 2004Date of Patent: September 11, 2007Assignee: Gun Ei Chemical Industry Co., Ltd.Inventors: Akihiro Okubo, Tatsunosuke Murakami, Fumitoshi Takeuchi, Koki Shiduka
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Publication number: 20060284346Abstract: The resin-coated sand is produced by coating the surface of a refractory granular aggregate with a thermosetting resin and a thermoplastic resin. When using this resin-coated sand, a mold with a less rough surface can be produced by a RP molding apparatus. When using this mold made of the resin-coated sand, a casting with fewer gas defects can be produced.Type: ApplicationFiled: August 11, 2006Publication date: December 21, 2006Applicant: GUN EI CHEMICAL INDUSTRY CO., LTD.Inventors: Akihiro Okubo, Tatsunosuke Murakami, Fumitoshi Takeuchi, Koki Shiduka
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Patent number: 7087799Abstract: An object of the present invention is to provide a material which resolves the drawbacks associated with polyimide polymers, and yet retains the advantages offered by conventional polyimide polymers. An amino group containing phenol derivative of the present invention is represented by a general formula (1) show below, and the present invention also provides a polyimide precursor produced using such an amino group containing phenol derivative. (wherein, R1, R2 and R3, which may be the same or different, each represent an alkyl group of 1 to 9 carbon atoms, an alkoxy group of 1 to 10 carbon atoms, a COOR group (in which R represents an alkyl group of 1 to 6 carbon atoms) or a hydrogen atom; R4 and R5, which may be the same or different, each represent an alkyl group of 1 to 9 carbon atoms or a hydrogen atom; X represents —O—, —S—, —SO2—, —C(CH3)2—, —CH2—, —C(CH3)(C2H5)—, or —C(CF3)2—; and n represents an integer of 1 or greater).Type: GrantFiled: January 31, 2003Date of Patent: August 8, 2006Assignee: Gun Ei Chemical Industry Co., Ltd.Inventors: Takeshi Tsuihiji, Michiyasu Yamazaki
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Patent number: 7019045Abstract: An object of the present invention is to provide a material which resolves the drawbacks associated with polyimide polymers, and yet retains the advantages offered by conventional polyimide polymers. An amino group containing phenol derivative of the present invention is represented by a general formula (1) show below, and the present invention also provides a polyimide precursor produced using such an amino group containing phenol derivative. (wherein, R1, R2 and R3, which may be the same or different, each represent an alkyl group of 1 to 9 carbon atoms, an alkoxy group of 1 to 10 carbon atoms, a COOR group (in which R represents an alkyl group of 1 to 6 carbon atoms) or a hydrogen atom; R4 and R5, which may be the same or different, each represent an alkyl group of 1 to 9 carbon atoms or a hydrogen atom; X represents —O—, —S—, —SO2—, —C(CH3)2—, —CH2—, —C(CH3)(C2H5)—, or —C(CF3)2—; and n represents an integer of 1 or greater).Type: GrantFiled: May 9, 2005Date of Patent: March 28, 2006Assignee: Gun Ei Chemical Industry Co., Ltd.Inventors: Takeshi Tsuihiji, Michiyasu Yamazaki
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Publication number: 20050197482Abstract: An object of the present invention is to provide a material which resolves the drawbacks associated with polyimide polymers, and yet retains the advantages offered by conventional polyimide polymers. An amino group containing phenol derivative of the present invention is represented by a general formula (1) show below, and the present invention also provides a polyimide precursor produced using such an amino group containing phenol derivative. (wherein, R1, R2 and R3, which may be the same or different, each represent an alkyl group of 1 to 9 carbon atoms, an alkoxy group of 1 to 10 carbon atoms, a COOR group (in which R represents an alkyl group of 1 to 6 carbon atoms) or a hydrogen atom; R4 and R5, which may be the same or different, each represent an alkyl group of 1 to 9 carbon atoms or a hydrogen atom; X represents —O—, —S—, —SO2—, —C(CH3)2—, —CH2—, —C(CH3)(C2H5)—, or —C(CF3)2—; and n represents an integer of 1 or greater).Type: ApplicationFiled: May 9, 2005Publication date: September 8, 2005Applicant: Gun Ei Chemical Industry Co., Ltd.Inventors: Takeshi Tsuihiji, Michiyasu Yamazaki
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Publication number: 20040197558Abstract: The resin-coated sand is produced by coating the surface of a refractory granular aggregate with a thermosetting resin and a thermoplastic resin. When using this resin-coated sand, a mold with a less rough surface can be produced by a RP molding apparatus. When using this mold made of the resin-coated sand, a casting with fewer gas defects can be produced.Type: ApplicationFiled: March 31, 2004Publication date: October 7, 2004Applicant: Gun Ei Chemical Industry Co., Ltd.Inventors: Akihiro Okubo, Tatsunosuke Murakami, Fumitoshi Takeuchi, Koki Shiduka
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Patent number: 6653418Abstract: There is provided a process for preparing a polymer compound for a resist, which can improve the performance, such as the heat resistance, sensitivity and resolution of the resist, without causing film loss of the resist, line width reduction of the resist or deterioration of the dry etching resistance of the polymer. This process comprises dissolving a styrene-based monomer containing at least a 4-acetoxystyrene monomer, and a dimethyl-2,2′-azobiscarboxylate ester in a solvent, thereby to polymerize the styrene-based monomer; adding an alkali catalyst to the resulting polymer solution, thereby to hydrolyze the polymer solution; and washing the resulting polymer compound with water.Type: GrantFiled: August 16, 2002Date of Patent: November 25, 2003Assignee: Gun EI Chemical Industry Co., Ltd.Inventors: Katsuhiro Maruyama, Satoru Yoshida, Satoru Kitano, Hitoshi Mashio
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Publication number: 20030215734Abstract: An object of the present invention is to provide a material which resolves the drawbacks associated with polyimide polymers, and yet retains the advantages offered by conventional polyimide polymers.Type: ApplicationFiled: January 31, 2003Publication date: November 20, 2003Applicant: Gun Ei Chemical Industry Co., Ltd.Inventors: Takeshi Tsuihiji, Michiyasu Yamazaki
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Patent number: 6242533Abstract: The present invention relates to a novolak type phenol resin, in particular a novolak type phenol resin for resists suitable for forming resist patterns. The novolak type phenol resin of the present invention is obtained by reacting at least a vinylphenol having a vinyl group and a phenolic hydroxyl group, such as parahydroxystyrene, or a polyvinylphenol, which is a polymer of the vinylphenol, a compound (A) such as 4,4′-methylenebis(2-hydroxymethyl-3,6-dimethylphenol) and/or a compound (B) such as 2,6-dihydroxymethyl-4-phenol, in a ratio of 1 to 40 moles of the compound (A) and/or compound (B) to 100 moles of the vinylphenol or 100 moles of structural unit of the vinylphenol contained in the polyvinylphenol in the presence of an acid and having a weight average molecular weight of 2,000 to 20,000. Such a novolak type phenol resin provides good pattern shape, heat resistance, resolution, and sensitivity in resists for lithography.Type: GrantFiled: May 31, 2000Date of Patent: June 5, 2001Assignee: Gun Ei Chemical Industry Co., Ltd.Inventors: Yoshiaki Kurimoto, Katsuhiro Maruyama, Akira Yoshitomo, Satoru Yoshida, Satoru Kitano
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Patent number: 6211328Abstract: The present invention relates to a phenol resin, in particular a phenol resin for resists suitable for forming resist patterns. The phenol resin of the present invention is obtained by reacting at least two components, i.e., a compound (A) such as 4-hydroxymethyl-2,6-dimethylphenol and a polymerizable phenol compound such as parahydroxystyrene or a polymer (B), which is a polymer of the polymerizable phenol compound, in a ratio of 1 to 50 moles of the compound (A) to 100 moles of the polymerizable phenol compound or 100 moles of structural unit of the polymerizable phenol compound contained in the polymer (B) in the presence of an acid and having a molecular weight of 2,000 to 20,000. Such a phenol resin provides good pattern shape, heat resistance, resolution, and sensitivity in resists for lithography.Type: GrantFiled: June 1, 2000Date of Patent: April 3, 2001Assignee: Gun Ei Chemical Industry Co., LTDInventors: Yoshiaki Kurimoto, Katsuhiro Maruyama, Akira Yoshitomo, Satoru Yoshida, Satoru Kitano
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Patent number: 6124420Abstract: This invention provides a novolak type epoxy resin which has low melt viscosity but shows high heat resistance when hardened. Particularly, it relates to a novolak type epoxy resin in which the relationship between the total % by weight of 3 to 6 nucleus bodies and the melt viscosity measured by a cone plate method at 150.degree. C. satisfies specified conditions, an epoxy resin composition containing the same and hardened products thereof.Type: GrantFiled: December 5, 1997Date of Patent: September 26, 2000Assignees: Nippon Kayaku Kabushiki Kaisha, Gun Ei Chemical Industry Co., Ltd.Inventors: Kenichi Kuboki, Yoshio Shimamura, Ryoichi Hasegawa, Yoshiaki Kurimoto, Akiyuki Kojima, Yukio Abe
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Patent number: 6001949Abstract: One of the objects of the present invention is to offer novolak type phenolic resins which use phenols and aldehydes as raw materials and give narrow molecular weight distributions.The novolak type phenolic resins of the present invention are those obtained by condensation reaction of phenols with aldehydes in the presence of an oxycarboxylic acid having carboxyl groups, --COOH, and alcoholic hydroxyl groups, --OH, in one molecule. Thus obtained novolak type phenolic resins show narrow molecular weight distributions, lower viscosity in molten state and, as a consequence, uniformity in curing time.Type: GrantFiled: December 13, 1995Date of Patent: December 14, 1999Assignee: Gun Ei Chemical Industry Co., Ltd.Inventors: Yoshiaki Kurimoto, Akiyuki Kojima, Yukio Abe, Tsuyoshi Fukuda, Kaori Hasegawa
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Patent number: 5929191Abstract: One of the objects of the present invention is to offer novolak type phenolic resins which use phenols and aldehydes as raw materials and give narrow molecular weight distributions.The novolak type phenolic resins of the present invention are those obtained by condensation reaction of phenols with aldehydes in the presence of an oxycarboxylic acid having carboxyl groups, --COOH, and alcoholic hydroxyl groups, --OH, in one molecule. Thus, obtained novolak type phenolic resins show narrow molecular weight distributions, lower viscosity in molten state and, as a consequence, uniformity in curing time.Type: GrantFiled: May 27, 1997Date of Patent: July 27, 1999Assignee: Gun Ei Chemical Industry Co., Ltd.Inventors: Yoshiaki Kurimoto, Akiyuki Kojima, Yukio Abe, Tsuyoshi Fukuda, Kaori Hasegawa
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Patent number: 5859168Abstract: One of the objects of the present invention is to offer novolak type phenolic resins which use phenols and aldehydes as raw materials and give narrow molecular weight distributions.The novolak type phenolic resins of the present invention are those obtained by condensation reaction of phenols with aldehydes in the presence of an oxycarboxylic acid having carboxyl groups, --COOH, and alcoholic hydroxyl groups, --OH, in one molecule. Thus obtained novolak type phenolic resins show narrow molecular weight distributions, lower viscosity in molten state and, as a consequence, uniformity in curing time.Type: GrantFiled: November 22, 1996Date of Patent: January 12, 1999Assignee: Gun Ei Chemical Industry Co., Ltd.Inventors: Yoshiaki Kurimoto, Akiyuki Kojima, Yukio Abe, Tsuyoshi Fukuda, Kaori Hasegawa
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Patent number: 5545458Abstract: A foamed phenolic molding composed of a core made of a kraft paper honey comb structure consisting of plate and corrugate members impregnated with a phenolic resin; and expandable phenolic composites laminated to said core, wherein the expandable phenolic composites are made of a matted fiber material formed in the shape of a plate to which phenolic resin is bonded to at least one thereof. The expandable phenolic composites and core are molded such that the expandable phenolic material fills the cells of the kraft paper honey comb structure. The molding has excellent thermal insulation and sound insulating properties as well as high strength as compared to conventional cores without sacrificing to the lightweight characteristics and workability of the quadratic surfaces.Type: GrantFiled: August 29, 1994Date of Patent: August 13, 1996Assignees: Kawasaki Heavy Industries, Ltd., Gun-Ei Chemical Industry Co., Ltd., Nippon Techma Engineering Corp.Inventors: Saburo Fukushima, Masaharu Yagi, Kiyozi Morita, Masami Ando, Tokuo Saito
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Patent number: 5230960Abstract: An activated and heat-treated product of a pitch fiber (A) is combined with an activated and heat-treated product of a precursor fiber of carbon fiber (B) having a larger elongation and a larger shrinkage during activation treatment thereof than those of the pitch fiber (A) to provide an activated carbon fiber structure. The activated carbon fiber structure is produced by subjecting the pitch fiber (A) and the precursor fiber of carbon fiber (B) to an activation treatment before or after the fibers (A) and (B) are formed into a configuration corresponding to a fiber structure through mixing or laminating.Type: GrantFiled: January 7, 1991Date of Patent: July 27, 1993Assignee: Gun Ei Chemical Industry Co., Ltd.Inventor: Toshi Iizuka