Abstract: A clamp for dipping printed circuit boards into a solder bath of a solder coater machine is disclosed. The clamp comprises first and second interdigitated, coplanar fingers connected respectively at common ends thereof to a pair of spaced, parallel first and second plates. Pivot pins respectively connect adjacent first and second fingers to each other to define a pivot axis extending parallel to and between the distal ends of fingers and the first and second plates. The second plate is spring biased from and movable towards the first plate under an applied actuating force to pivot the second fingers out the plane of the first fingers enabling insertion of a printed circuit board between clamping surfaces defined by the distal ends. The pivot pins and spring mechanism are spaced a sufficient distance from the distal ends to avoid contamination by solder particles and flux during the coating process and to avoid interference with air leveling knives closely spaced to the coated board upon removal from the bath.