Abstract: A method for trenching below the water table in environmentally sensitive areas such as the Florida Keys is shown. A first pass made by a trencher digs a first trench from the surface to the water table. During the first pass, relatively dry spoil is removed from the first trench. Next, a much deeper second trench is dug below the first trench; however, wet spoil remains in the now combined first and second trench, the combined first and second trench being large enough to accumulate the wet spoil with expansion. Thereafter, the combined first and second trench may be filled with the relatively dry spoil, packed and driven upon. Later, the packed spoil may be removed and water pipes, electric cables, sewer lines or the like buried in the trench. According to the requirements of the work area, the spoil may be used to partially fill the combined first and second trench or be hauled away.
Type:
Grant
Filed:
August 27, 2008
Date of Patent:
January 18, 2011
Assignee:
H.L. Chapman Pipeline Construction, Inc.