Abstract: An automated door removal and replacement system utilizes a combination of linear and rotational drive to remove a door of a wafer supporting device and store the door below the device. In one embodiment, the wafer-supporting device is a Front Opening Unified Pod (FOUP). A door-contacting assembly is pivotally mounted to include a horizontal rest position and a vertical unlocking position. In the horizontal rest position, the assembly resides below the wafer-supporting device. The assembly is rotated to a vertical position and then linearly moved to engage the door. Keys of the assembly are manipulated to release the door. The assembly and the door are moved rearwardly and the assembly is pivoted to the rest position, clearing the opening to the wafer-supporting device.

Abstract: A method and a system for seating and unseating cassette lids from cassettes include utilizing two upright guides that are spaced apart by a distance that causes each guide to project between a cassette and a flap of a cassette lid. Outwardly facing surfaces of the guides are sloped such that the guides have an increasing cross sectional area with approach toward a base of the device. In an unseating operation, downward pressure is applied to the cassette lid, causing the flaps of the cassette to follow the sloped contour of the outwardly facing guide surfaces. The configuration of the guides causes the flaps to separate from the downwardly moving cassette. When the pressure is relaxed, material memory causes the lid to return to its original shape, sliding up the guides while the cassette remains in place. For some cassettes, structure for retaining the cassette in position may be beneficial.

Abstract: A size-convertible device for supporting wafers in a parallel relationship includes a removable insert that enables the device to be non-destructively switched from providing edge support for large diameter wafers to providing edge support for small diameter wafers. The insert maintains the original wafer pitch and the original insertion angle. In the preferred embodiment, the device is a Front Opening Unified Pod (FOUP) specifically designed for use with 300 mm diameter wafers. Inserts are releasably attached to opposite sides of the FOUP to convert the device to a 200 mm diameter pod. The axis of the rest positions of the small wafers is coaxial with the rest positions of the large wafers. However, the inserts may be adapted to move the rest positions of the small wafers forwardly to a position such that there is front edge alignment with respect to rest positions of the large and small wafers.

Abstract: A method and device for handling fabrication articles in an electronics application includes a pickup head with an array of article-holding slots aligned to receive the articles and includes a drive mechanism for tilting the pickup head. Cantilevered support members, such as support rods, have first ends attached to the pickup head and are arranged to form article-receiving regions that are generally aligned with the article-holding slots. In the preferred embodiment, the article-holding slots have a geometry for supporting the fabrication articles when the support members are in an upright condition, i.e. when the articles are vertically oriented. Also in the preferred embodiment, the device includes stops that prevent the articles from entering the slots when the support members are in a horizontal condition. The stops provide a controlled exit and entrance of the articles from and into the slots as the pickup head is tilted, thereby reducing the risk of breakage.

Abstract: An apparatus and method for aligning indexing notches of disk-shaped members, such as semiconductor wafers, include providing an alignment rod that is driven by another roller to cause rotation of the disk-shaped members. The circumferential surfaces of the alignment rod and the drive roller are in frictional contact. Initially, the disk-shaped members rest upon the alignment rod, so that rotation of the alignment rod causes rotation of the disk-shaped members until indexing notches are seated on the alignment rod. In the preferred embodiment, the seating of the indexing notches transfers at least a portion of the weight of the disk-shaped members to a reciprocating structure, such as a comb member. After all of the indexing notches have been aligned, a second weight transfer occurs, with the reciprocating structure following the contour of the drive roller and the disk-shaped members coming to rest on the drive roller. The disk-shaped members can then be uniformly rotated to locate the notches as desired.

Abstract: An orientation apparatus for aligning indexing notches of disk-shaped members, such as semiconductor wafers, includes a flexible alignment rod that imparts rotation of the disk-shaped members until the indexing notches are registered with the alignment rod. The alignment rod is captured by a displaceable comb member that exposes regions of the rod between adjacent teeth. The teeth ensure that the disk-shaped members are properly aligned. The comb member has a raised operation position in which the disk-shaped members are spaced apart from rollers and has a lowered retracted position in which the weight of the disk-shaped members is transferred to the rollers. A camming mechanism may be used to raise and lower the comb member and alignment rod between the two positions.

Abstract: A vacuum-actuated article handling tool includes an electrically conductive wand body that is selectively coupled to a pickup tip by a static dissipative connecting assembly. The connecting assembly preferably includes a rigid, electrically insulative cap. The cap is rigid in order to securely hold the tip and is electrically insulative in order to prevent direct contact of the conductive tip to the conductive wand body. The connecting assembly includes a resistive member that is preferably flexible. The flexibility allows the resistive member to conform to the shape and position of the tip, so that a repeatable tip-to-wand electrical connection is made. The resistive member is formed of a material that achieves a desired current-limiting resistive path, thereby providing protection for handled articles that are susceptible to damage by electrostatic discharge.

Abstract: A battery-powered portable tool for handling electronic workpieces, such as semiconductor wafers, wherein a desired pressure differential is generated by a serial connection of vacuum pumps. The tool includes a number of features which minimize the generation of particulate matter. The pumps are sealed in an airtight chamber to prevent the release of particles created during operation of the pumps. The tool is exhausted directly to the ambient atmosphere to prevent pump exhaust from disturbing particles within the tool. The valve is designed to provide a quick release of even lightweight workpieces and to minimize the sliding of valve components against each other. Submicron filtering removes any particles from the pump exhaust.

Abstract: A vacuum-actuated tool for handling of electronic articles, such as integrated circuit chips, wherein the tool includes an elongated body having first, second, and third passageways. The second passageway is connected to a vacuum source, while the first passageway leads to a pickup tip that contacts the article to be handled. Positive pressure sealing provides a leak-proof closure of the second passageway when the article is to be released. The third passageway is in fluid communication with the atmosphere and is linked to the first passageway simultaneously with the positive pressure sealing of the second passageway. In a pickup position, the third passageway to the atmosphere is pressure sealed to prevent leakage through the third passageway to the atmosphere. The pressure seals are provided by elastomeric members.

Abstract: A hand-held surface mount pick having a handle and a bellows. The handle includes a vacuum passageway with an evacuation opening at a first end and a plurality of closely spaced vents along an intermediate region. At an end opposite to the evacuation opening is a fitting for attachment to a source of vacuum. The bellows is connected to the first end and is in fluid communication with the vacuum source via the fitting and in fluid communication with the ambient atmosphere via the vents. A protective shield is coupled to the handle at the first end. The bellows has a relaxed condition in which a portion of the bellows extends beyond the protective shield to contact an electronic component. Upon contact with the component, the vents are covered by the finger of a user, thereby creating a vacuum within the bellows to draw the component into the protective shield.

Abstract: A metallic tip for attachment to a vacuum-operated wand of the type for handling of semiconductor wafers and the like. The wand tip has a tubular portion for attachment to the wand and has a flattened portion with generally parallel upper and lower walls extending from the tubular portion. The lower wall has a slotted region to expose the inner surface of the upper wall so as to define a vacuum pocket. The upper wall has a raised region to promote stiffness and to allow fluid communication between the tubular portion and the vacuum pocket. The upper and lower walls are in physical contact and are in vacuum-sealed relation about the major portion of the periphery of the vacuum pocket. The unitary tip is formed by compressing a portion of a tubular metallic member to form the upper and lower walls. A slot is machined into the lower wall to provide the vacuum pocket, afterwhich a mandrel is inserted into the tubular portion and a second compression is performed.