Abstract: An electronic device may include electronic circuitry and a housing carrying the electronic circuitry. The housing may include first and second metallic housing members having opposing first and second mating surfaces respectively defining a projection and a corresponding recess. The projection may be spaced inwardly from a perimeter of the first housing member, and the recess may be spaced inwardly from a perimeter of the second housing member. The electronic device may further include a gasket between the opposing first and second mating surfaces and extending outwardly to perimeters of the first and second mating surfaces. The gasket may include indium.

Abstract: An electronic device may include electronic circuitry and a housing carrying the electronic circuitry. The housing may include first and second metallic housing members having opposing first and second mating surfaces respectively defining a projection and a corresponding recess. The projection may be spaced inwardly from a perimeter of the first housing member, and the recess may be spaced inwardly from a perimeter of the second housing member. The electronic device may further include a gasket between the opposing first and second mating surfaces and extending outwardly to perimeters of the first and second mating surfaces. The gasket may include indium.

Abstract: An electronic assembly may include a housing having an opening therein and an RF feedthrough connector in the opening of the housing. The RF feedthrough connector may include a tubular body, and a plurality of displaceable protrusions carried by an upper outer surface portion of the tubular body. The plurality of displaceable protrusions may define an enlarged upper portion thereof engaging adjacent upper portions of the housing. The RF feedthrough connector may also include a sealed joint between the housing and the RF feedthrough connector.

Abstract: An electronics package may include a housing and electronic circuitry carried thereby. The housing may include a first metallic material having a first coefficient of thermal expansion (CTE) and having an array of openings therein. The electronics package may also include a thermally conductive body within each of the openings in the array thereof to thereby define a heat sink for the electronic circuitry. Each of the thermally conductive bodies may include a second metallic material having a second CTE substantially different from the first CTE.

Abstract: An electronics package may include a housing and electronic circuitry carried thereby. The housing may include a first metallic material having a first coefficient of thermal expansion (CTE) and having an array of openings therein. The electronics package may also include a thermally conductive body within each of the openings in the array thereof to thereby define a heat sink for the electronic circuitry. Each of the thermally conductive bodies may include a second metallic material having a second CTE substantially different from the first CTE.

Abstract: A hermetically sealed package for electronic circuit components includes a generally hollow, titanium body, having a reduced thickness bottom wall/floor, whose interior surface is laminated with a relatively low mass, insert, upon which electronic circuit components are mounted. The insert has a high thermal conductivity and a low coefficient of thermal expansion, approximate to that of the housing body.

Abstract: An electronic assembly may include a housing having an opening therein and an RF feedthrough connector in the opening of the housing. The RE feedthrough connector may include a tubular body, and a plurality of displaceable protrusions carried by an upper outer surface portion of the tubular body. The plurality of displaceable protrusions may define an enlarged upper portion thereof engaging adjacent upper portions of the housing. The RF feedthrough connector may also include a sealed joint between the housing and the RF feedthrough connector.

Abstract: An improved feed-through RF connector uses structural materials with coefficients of thermal expansion selected to enhance the reliability of a hermetic seal. The design of the connector and the selection of materials facilitate easy installation and help avoid cyclic fatigue and cracks that could result in a loss of hermetic seal.