Abstract: A compliant pin for preferable insertion into a multi-layer backpanel is disclosed. The pin includes a wire-wrap area, a pin stop, and a connector area. Between the connector area and the stop there is located the compliant area which forms the critical function of pin support and electrical connection. The compliant area includes first and second legs spreading out to define an eye from the pin stop adjacent the wire-wrap area of the pin. Similarly, the paired legs come together at a symmetrically defined eye adjacent the connector area. In between the eyes, along the compliant portions of the leg, are formed opposing offset wedges. The opposing offset wedges are defined by a stamping process which process does not deform the sheet of material out of which the pin is made from its original planar disposition. Looking at the pin in section, paired and offset wedges are formed at an approximate 45.degree. angle to the plane of the material from which the pin is formed.