Patents Assigned to Hae-Wook LEE
  • Composition for cutting off heat-ray, film formed therefrom, and method for forming the composition and the film
    Patent number: 8038786
    Abstract: Disclosed are heat-ray cutoff compounds, films and method using them. The heat-ray compound is produced by dispersing conductive nanoparticles in an amphoteric solvent with acids and dispersion sol, which provides a low cost production for the heat-ray cutoff films because it is able to any resin binder without sorting the kinds of resin binders (hydrolic or alcoholic, or anti-hydrolic).
    Type: Grant
    Filed: March 17, 2003
    Date of Patent: October 18, 2011
    Assignee: Hae-Wook LEE
    Inventors: Hae-Wook Lee, Jin-Hong Park