Patents Assigned to HAKKO CORP.
-
Patent number: 11316326Abstract: A handheld device for thermal cartridges which may include a wire stripping cartridge for stripping insulation from sections of an insulated electrical wire, or a thermal tweezer cartridge for de-soldering and removing electrical components, and more particularly a hand-operated electrically heated thermal devices with a replaceable cartridges.Type: GrantFiled: May 3, 2018Date of Patent: April 26, 2022Assignee: Hakko CorpInventors: Hisao Nemoto, Tomoyo Maeshima, Norihisa Sekimori
-
Patent number: 11313733Abstract: The invention is directed to embodiments of a temperature sensor for use with a temperature measuring device, for example a digital thermometer. The temperature sensor includes at least two and preferably three wires joined at a thermocouple. The temperature sensor is designed to be mounted on terminals of the digital thermometer sensor to allow precise temperature measurements for a thermal device, for example a soldering tool or de-soldering tool.Type: GrantFiled: May 22, 2019Date of Patent: April 26, 2022Assignee: Hakko Corp.Inventors: Hiroyuki Masaki, Tomoyo Maeshima
-
Patent number: 11273509Abstract: A heating tool having a temperature sensor fixed within a tip of the heating tool with maximum heat conductivity to the temperature sensor.Type: GrantFiled: June 25, 2019Date of Patent: March 15, 2022Assignee: Hakko Corp.Inventors: Kenji Matsuzaki, Kenta Nakamura
-
Patent number: 11059118Abstract: A cordless, hand held soldering iron operable with a control station providing wireless temperature control functionality and a charging station.Type: GrantFiled: September 26, 2018Date of Patent: July 13, 2021Assignee: Hakko Corp.Inventors: Yoshitomo Teraoka, Kenta Nakamura
-
Patent number: 11052479Abstract: A smartphone, tablet or mobile computer based soldering system control method and apparatus to allow a user or supervisor of users to monitor and control the operating parameters of soldering devices or measuring device. The control method and apparatus has features for cartridge management, temperature calibration and control, user performance and wireless interactive control. The control method may interactively control soldering devices connected directly to a power supply and optionally soldering device components of a soldering system that includes a control station to provide power to the soldering device.Type: GrantFiled: October 30, 2018Date of Patent: July 6, 2021Assignee: HAKKO CORP.Inventors: Mitsuhiko Miyazaki, Yasumasa Igi, Nobuharu Boh
-
Patent number: 10802449Abstract: The present invention is intended to ease the control and management of soldering devices, and enhance convenience. In accordance with the intention of the invention, a system includes a power supply unit having a connecting cable to be connected to soldering devices, a power supply portion supplying power to the soldering devices through the connecting cable, a power supply control portion to control the power supply from the power supply portion based on a temperature setting signal T(s) set in advance and a control unit that may be physically separated from the power supply unit but which inputs the temperature setting signal T(s) to the power supply control portion of the power supply unit.Type: GrantFiled: August 1, 2014Date of Patent: October 13, 2020Assignee: Hakko Corp.Inventors: Yoshitomo Teraoka, Kenta Nakamura, Yasumasa Igi
-
Patent number: 10618127Abstract: The present invention defines a tool including a heating device including a method and apparatus to allow the user to check whether, or be notified when, the soldered electronic component is completely removed from a substrate after the solder is sufficiently melted.Type: GrantFiled: December 13, 2016Date of Patent: April 14, 2020Assignee: Hakko Corp.Inventors: Yoshitomo Teraoka, Hisao Nemoto
-
Patent number: 9981332Abstract: A holding stand for a heating tool such as a soldering or de-soldering device. The holding stand has a rotary member for securing the heating tool and an assembly for moving and positioning the rotary member with the heating tool in any of three axis.Type: GrantFiled: September 12, 2016Date of Patent: May 29, 2018Assignee: Hakko CorpInventors: Yoshitomo Teraoka, Hisao Nemoto
-
Patent number: 9931705Abstract: A method or process of fabricating a solder cartridge and solder cartridge made according to the process is disclosed. The solder cartridge made according to the process provides a self-temperature regulating solder tip for an inductive current soldering station having improved heater quality and stability with reduced manufacturing costs.Type: GrantFiled: September 20, 2013Date of Patent: April 3, 2018Assignee: Hakko Corp.Inventors: Mitsuhiko Miyazaki, Hisao Nemoto
-
Patent number: 9497883Abstract: A noise suppression circuit board design to provide a power supply to an inductive heating element is disclosed. The noise suppression circuit provides a configuration for a multi-layer circuit board that has radiation noise emissions below the CISPR 11 (limits and methods of measurements of radio disturbance characteristics of industrial, scientific and medical (ISM) radio-frequency equipment) thresholds in the 30 MHz to 1 GHz frequency range.Type: GrantFiled: March 24, 2014Date of Patent: November 15, 2016Assignee: HAKKO CORP.Inventors: Yokoyama Tetsuo, Sanamoto Masashi