Abstract: A fast low voltage ballistic program, ultra-short channel, ultra-high density, dual-bit multi-level flash memory is described. The structure and operation of this invention is enabled by a twin MONOS cell structure having an ultra-short control gate channel of less than 40 nm, with ballistic injection which provides high electron injection efficiency and very fast program at low program voltages of 3˜5V. The ballistic MONOS memory cell is arranged in the following array: each memory cell contains two nitride regions for one word gate, and ½ a source diffusion and ½ a bit diffusion. Control gates can be defined separately or shared together over the same diffusion. Diffusions are shared between cells and run in parallel to the side wall control gates, and perpendicular to the word line.

Abstract: The present invention relates to a nonvolatile memory cell and/or array and a method of operating the same high integrated density nonvolatile memory cell enabling high integration density, low voltage programming and/or high speed programming, a method of programming same and a nonvolatile memory array. A p-well 101 is formed in a surface of a substrate 10 and a channel forming semiconductor region 110 is defined in a surface of the p-well 101 and separated by a first n+ region 121 and a second n+ region 122. A carrier-supplying portion (CS: carrier supply) 111 is formed coming into contact with the first n+ region 121 and a carrier-acceleration-injection portion 112 (AI: acceleration and injection) is in contact with the second n+ region 122 in the channel forming semiconductor region 110 wherein the carrier-supplying portion 111 and carrier-acceleration-injection portion 112 are in contact with each other.

Abstract: A fast low voltage ballistic program, ultra-short channel, ultra-high density, dual-bit multi-level flash memory is described. The structure and operation of this invention is enabled by a twin MONOS cell structure having an ultra-short control gate channel of less than 40 nm, with ballistic injection which provides high electron injection efficiency and very fast program at low program voltages of 3˜5V. The ballistic MONOS memory cell is arranged in the following array: each memory cell contains two nitride regions for one word gate, and ½ a source diffusion and ½ a bit diffusion. Control gates can be defined separately or shared together over the same diffusion. Diffusions are shared between cells and run in parallel to the side wall control gates, and perpendicular to the word line.

Abstract: A wordline decoder for high density flash memory is described with negative voltage capability for memory operations such as erase. A main decoder is shared with a plurality of wordline driver circuits to reduce wiring congestion and overall layout size. In a second embodiment, a wordline decoder for fast read access is provided in which a high speed positive voltage decoder is separate from the negative voltage decoder with the addition of a triple well NMOS transistor into the inverter driver circuits. The use of triple well NMOS transistors reduces circuit and layout complexity.

Abstract: Presented in this invention is a fabricating method and its array organization for a high-density twin MONOS memory device integrating a twin MONOS memory cell array and CMOS logic device circuit. The invention consists of two fabrication methods, i) Simultaneous definition of memory gate and logic gate, thus improving the process integration scheme for easier and more reliable fabrication. ii) Bit line crosses word gate and control gate. The invention focuses on lowering parasitic sheet resistances to enable high speed while maintaining low manufacturing cost. The twin MONOS cell stores memory in two nitride memory cell elements underlying two shared control gates on both sidewalls of a select gate. The method is applicable to a device with a flat channel and/or a device having a step channel. Two embodiments of the present invention are disclosed.

Abstract: The present invention relates to a nonvolatile memory cell and/or array and a method of operating the same high integrated density nonvolatile memory cell enabling high integration density, low voltage programming and/or high speed programming, a method of programming same and a nonvolatile memory array. A p-well 101 is formed in a surface of a substrate 10 and a channel forming semiconductor region 110 is defined in a surface of the p-well 101 and separated by a first n+ region 121 and a second n+ region 122. A carrier-supplying portion (CS: carrier supply) 111 is formed coming into contact with the first n+ region 121 and a carrier-acceleration-injection portion 112 (AI: acceleration and injection) is in contact with the second n+ region 122 in the channel forming semiconductor region 110 wherein the carrier-supplying portion 111 and carrier-acceleration-injection portion 112 are in contact with each other.

Abstract: A spark plug for an internal combustion engine is provided with a double ringed ground electrode permanently affixed to the spark plug base. One ring is used for the attachment and the other, held apart by one or more legs, is suspended circumferentially and perpendicular to the longitudinal axis of the spark plug a set distance from the center electrode. The method of manufacturing a spark plug comprises the steps of providing a spark plug base, providing a ring shaped ground electrode with enhancements to accomplish shielding and centering of the piece, providing a welding apparatus for rotable welding of said ring shaped ground electrode to said spark plug base, providing an alignment tool for aligning said ring shaped ground electrode with said spark plug base, aligning the ring shaped ground electrode with said spark plug base and welding the ring shaped ground electrode to said spark plug base to form a spark plug.