Patents Assigned to Hamfop Technologies LLC
  • Patent number: 11898578
    Abstract: A heat-activated multiphase fluid-operated pump. A hot chamber receptive of externally applied heat converts a working fluid into vapor. A pressure-control valve allows vaporized working fluid to escape the hot chamber only when a target pressure is exceeded. A liquid-piston chamber receives the vaporized working fluid, which expands adiabatically to displace pumped liquid within the liquid-piston chamber in a pump stage, expelling it through an exit port having a unidirectional check valve. A condenser receives the displaced liquid and allowing it in a suction stage to return to the liquid-piston chamber through another unidirectional check valve. An injector valve coupled between the liquid-piston chamber and the hot chamber facilitates jets of condensed working fluid to replenish the hot chamber in successive brief spurts responsive to periodic pressure pulses in the liquid-piston chamber that temporarily exceed the pressure in the hot chamber.
    Type: Grant
    Filed: September 10, 2021
    Date of Patent: February 13, 2024
    Assignee: Hamfop Technologies LLC
    Inventor: Mudasir Ahmad
  • Patent number: 11874022
    Abstract: A heat-activated fluid pump heats and cools a building. For cooling, an evaporator, coupled to a solar heater or comprising multi-pane windows with solar radiation-absorbent areas thermally coupled to a fluid cavity, converts a working fluid into a vapor. A pressure control valve allows vaporized working fluid into a liquid-piston chamber whenever a target pressure in the evaporator is exceeded. The working fluid expands, displacing liquid from the liquid-piston chamber in a pump stage where it enters a condenser situated in a vertical hole or covered horizontal trench in the ground. Ground-temperature pumped fluid returning to the liquid-piston chamber in a suction stage passes along the way through coils in rooms of the building. Check valves allow replenishment of the evaporator with return working fluid and direct flow of pumped fluid into and out of the liquid-piston chamber. For heating, the evaporator is in the ground.
    Type: Grant
    Filed: September 10, 2021
    Date of Patent: January 16, 2024
    Assignee: Hamfop Technologies LLC
    Inventor: Mudasir Ahmad
  • Patent number: 11737240
    Abstract: A heat-activated pump removes waste heat from electronic components, at a data center, circuit board, or chip level. A set of evaporators receive heat from the electronics, converting a working fluid into vapor. Piping from the evaporators to a shared condenser(s) and back form a fluid circulation system. A pressure-control valve set for a specified electronic operating temperature allows vaporized working fluid to vent into a liquid-piston chamber, where it expands adiabatically, displacing pumped liquid in a pumping stage and expelling it from the chamber through a unidirectional valve to the shared condenser(s). The condenser(s) has a heatsink transferring heat away to a flow of cooler fluid. The pumped liquid returns in a suction cycle to the chamber through another unidirectional valve. An injector valve returns jets of condensed working fluid to the evaporator in successive brief spurts responsive to periodic pressure pulses in the chamber.
    Type: Grant
    Filed: September 10, 2021
    Date of Patent: August 22, 2023
    Assignee: Hamfop Technologies LLC
    Inventor: Mudasir Ahmad