Patents Assigned to Han-Mi Mold & Tool, Co., Ltd.
  • Molding machine for semiconductor package
    Patent number: 5501587
    Abstract: A molding machine is provided for a semiconductor package. The machine has two transfer rods for compressing resin into a leadframe of the mold. One transfer rod will move resin into the mold when the rod is moved downward and the second transfer rod will move resin into the mold when the rod is moves upwardly. Means are provided for selectively operating the transfer rods as needed depending on the type of mold used.
    Type: Grant
    Filed: September 1, 1994
    Date of Patent: March 26, 1996
    Assignee: Han-Mi Mold & Tool, Co., Ltd.
    Inventor: Nho K. Kwak
  • Mold for a semiconductor package
    Patent number: 5501588
    Abstract: A mold for a semiconductor package having a port for feeding resin which can be fixed either in an upper mold (1) or a bottom mold (2) corresponding to the location of the flange tip so that the operating rate of the equipment is increased to achieve high productivity.
    Type: Grant
    Filed: April 17, 1995
    Date of Patent: March 26, 1996
    Assignee: Han-Mi Mold & Tool Co., Ltd
    Inventor: Nho K. Kwak