Abstract: An early alert system and a method for livestock disease detection are disclosed. An activity measurement zone (AMZ) is defined near an incentive device (e.g. a livestock feeder) with an RFID tag reader and a uniquely-designed feedlot fence crossbar-embedded RFID antenna, which amplifies multiple signal wavelengths in a single dipole antenna. The early alert system is configured to detect and count an animal's access into the AMZ with an RFID tag attached to the animal. If the animals' activity relative to the AMZ drops to an alarmingly low level (e.g. dropping below an alert trigger point) over time, then a user of the early alert system is informed of a potential health problem of the animal and may also be encouraged to inspect the animal in person for further determination of its current health and potential medical issues.

Abstract: A fan-out wafer level package is disclosed, which includes: a redistribution layer; a semiconductor chip electrically connected with the redistribution layer through a bump; a protective member protecting the semiconductor chip, wherein a part of the protective member is removed such that the upper surface of the semiconductor chip is exposed in order to dissipate heat and prevent warpage; and an interconnector disposed outside the semiconductor chip at substantially the same level and having a lower part electrically connected with the redistribution layer and an upper part not being covered with the protective member, wherein the interconnector includes a metal core solder ball, the metal core solder ball includes a metal core and a solder buffer between the metal core and the protective member, and the metal core is formed of a combination of copper (Cu), nickel (Ni), and silver (Ag).

Abstract: A semiconductor device having a redistribution structure includes a redistribution layer provided on a semiconductor chip, and a passivation layer covering the redistribution layer while partially exposing the redistribution layer. The passivation layer has a thickness less than that of the redistribution layer.

Abstract: fan-out wafer level package is disclosed, which comprises: a redistribution layer; a semiconductor chip electrically connected with the redistribution layer through a bump; a protective member protecting the semiconductor chip, wherein a part of the protective member is removed such that the upper surface of the semiconductor chip is exposed in order to dissipate heat and prevent warpage; and an interconnector disposed outside the semiconductor chip at substantially the same level and having a lower part electrically connected with the redistribution layer and an upper part not being covered with the protective member, wherein the interconnector includes a metal core solder ball, the metal core solder ball includes a metal core and a solder buffer between the metal core and the protective member, and the metal core is formed of a combination of copper (Cu), nickel (Ni), and silver (Ag).

Abstract: A radio frequency identification (RFID) reader includes an RFID module configured to generate a radio frequency (RF) signal, a power divider configured to divide the generated RF signal into a plurality of RF signals having a same power, at least one antenna configured to transmit the divided RF signals, and a sensor configured to detect an object within a predetermined area and transmit a result of the detection of the object to the RFID module.

Abstract: The present invention provides a radio frequency identification (RFID) reader. The RFID reader includes an RFID module configured to generate a radio frequency (RF) signal, a power divider configured to divide the generated RF signal into a plurality of RF signals having the same power, at least one antenna configured to transmit the divided RF signals, and a sensor configured to detect an object within a predetermined area and transmit a result of the detection of the object to the RFID module.

Abstract: The present invention relates to a semiconductor package and a method of manufacturing the same. Specifically, the present invention relates to a semiconductor package including a substrate; a semiconductor chip mounted on the substrate; a connection element including an insulator mounted on the substrate and a first connection part of a conductive material formed at an end of the insulator; a molding part surrounding the semiconductor chip, and sealing the connection element for an upper surface of the first connection part to be exposed; and a shield layer surrounding the molding part, and forming an opening part on a part corresponding to the first connection part.

Abstract: A trackpad semiconductor package according to the present invention includes a printed circuit board (PCB), a trackpad device stacked on the PCB, a conductive wire configured to connect the PCB and the trackpad device, a glass assembly directly attached to the trackpad device using a die attach film, and an epoxy molding compound (EMC) mold configured to protect a partial region of the trackpad device that is not covered by the glass assembly and the conductive wire. According to the present invention, a sensing sensitivity is greatly improved.

Abstract: Provided is a method for manufacturing a track pad semiconductor package using compression molding, including: preparing an original glass assembly; attaching each track pad element on an original PCB; bonding a wire between the original PCB and the track pad element; bonding the original glass assembly onto the track pad element using compression molding of the EMC; and singulating the compression-molded original PCB. According to the configuration of the present disclosure, fingerprint recognizing sensitivity is significantly improved while minimizing the entire thickness of the package.

Abstract: A memory card system may include a flexible integrated circuit device package, an upper flexible case, a lower flexible case, a wiring structure, an anisotropic conductive film, etc. The flexible integrated circuit device package may include a material capable of being bent or folded and a flexible integrated circuit device having a connection pad for an electrical connection. The upper flexible case may include a material capable of being bent or folded and may cover the integrated circuit device package. The lower flexible case may include a material capable of being bent or folded and the flexible integrated circuit device package may be fixed to the lower flexible case.

Abstract: An integrated circuit device package may include a flexible substrate having a first wiring, an integrated circuit device having a second wiring, a flexible insulation structure having a first opening and a second opening exposing the first wiring and the second wiring, respectively, a third wiring electrically connecting the first wiring to the second wiring, and a flexible protection member covering the third wiring. A stacked flexible integrated circuit device package may include a flexible substrate, a first flexible integrated circuit device including a first connection pad, a second flexible integrated circuit device including a second connection pad, a connection wiring electrically connecting the first and the second connection pads to an external device, and a flexible protection member disposed on the second flexible integrated circuit device.

Abstract: An ear tag for recognizing livestock individual is provided.

Abstract: Disclosed are a foldable and spreadable electronic device and a method of manufacturing the electronic device. The electronic device may include a flexible chip, a protection film and a flexible substrate. The flexible chip may include a first wiring on a first face thereof. The flexible chip may have a foldable and spreadable structure by reducing a thickness from a second face thereof. The protection film may be disposed on the second face of the flexible chip for protecting the flexible chip. The flexible substrate may include a second wiring on one face thereof. The protection film on disposed on the second face of the flexible chip may make contact with the flexible substrate. The first wiring of the flexible chip may be electrically connected to the second wiring of the flexible substrate using a wire.

Abstract: An electronic component may include an integrated circuit device package and a second substrate. The integrated circuit device package may include a first substrate being bent or spread, a heat transfer member disposed in the first substrate, an integrated circuit device being bent or spread, a first pad disposed on one face of the integrated circuit device, and an adhesion member disposed between the integrated circuit device and the first substrate. The second substrate may be bent or spread. The second substrate may include a second pad. The integrated circuit device package may be combined with the second substrate by a thermo compression bonding process in which the heat transfer member may transfer a heat to the second substrate through the first substrate and the first pad may make contact with the second pad.

Abstract: Disclosed are a foldable and spreadable electronic device and a method of manufacturing the electronic device. The electronic device may include a flexible chip, a protection film and a flexible substrate. The flexible chip may include a first wiring on a first face thereof. The flexible chip may have a foldable and spreadable structure by reducing a thickness from a second face thereof. The protection film may be disposed on the second face of the flexible chip for protecting the flexible chip. The flexible substrate may include a second wiring on one face thereof. The protection film on disposed on the second face of the flexible chip may make contact with the flexible substrate. The first wiring of the flexible chip may be electrically connected to the second wiring of the flexible substrate using a wire.

Abstract: Disclosed are a foldable and spreadable electronic device and a method of manufacturing the electronic device. The electronic device may include a flexible chip, a protection film and a flexible substrate. The flexible chip may include a first wiring on one face thereof. The flexible chip may have a foldable and spreadable structure by reducing a thickness from a second face thereof. The protection film may be disposed on the second face of the flexible chip. The flexible substrate may include a second wiring on one face thereof. The first wiring may face the second wiring, and the first wiring may be electrically connected to the second wiring.

Abstract: A memory card system may include a flexible integrated circuit device package, an upper flexible case, a lower flexible case, a wiring structure, an anisotropic conductive film, etc. The flexible integrated circuit device package may include a material capable of being bent or folded and a flexible integrated circuit device having a connection pad for an electrical connection. The upper flexible case may include a material capable of being bent or folded and may cover the integrated circuit device package. The lower flexible case may include a material capable of being bent or folded and the flexible integrated circuit device package may be fixed to the lower flexible case.

Abstract: Provided is a stacked semiconductor package.

Abstract: Provided is a stacked semiconductor package. The stacked semiconductor package of the present invention comprises: a substrate including at least one contact pad; an external chip laminate which includes a plurality of semiconductor chips mounted on the substrate, and which is stacked in multi-steps such that the ends at one side of the plurality of semiconductor chips alternately protrude in opposite directions to expose bonding pads which are formed on the up-face surface; at least one internal chip which is disposed in a mounting space formed between the external chip laminate and substrate so as to be electrically connected to the substrate; and a conductive wire electrically connecting the bonding pad of the semiconductor chip and the contact pad of the substrate.

Abstract: Provided is a stacked semiconductor package. The present invention includes: a substrate having first and second connective pads provided on an upper surface thereof; a first cascade chip laminate which is loaded on the substrate and in which a plurality of first semiconductor chips are stacked in multiple stages to externally expose a first bonding pad wire-bonded through the first connective pad and a first conductive wire; a second cascade chip laminate in which a plurality of second semiconductor chips are stacked in the multiple stages to externally expose a second bonding pad wire-bonded through the second connective pad and a second conductive wire to an area corresponding to the first bonding pad; and a joint part for joining the first cascade chip laminate and the second cascade chip laminate.