Patents Assigned to HANGZHOU BINARY OPTOELECTRONICS & TECH CO., LTD.
  • Patent number: 11962155
    Abstract: The present disclosure provides a photovoltaic power generation system, relating to the technical field of new energy resources, including at least two photovoltaic power generation devices; each photovoltaic power generation device includes: a photovoltaic panel unit, which is configured to generate light-sensitive electrical energy based on photovoltaic effect; an energy storage unit, which is connected to an output end of the photovoltaic panel unit, and is configured to store the light-sensitive electrical energy; an input unit, of which one end is connected to the energy storage unit, and the other end is connected to the output end of the photovoltaic panel unit of the other photovoltaic power generation device; and an output unit, of which one end is connected to the output end of the photovoltaic panel unit, and the other end is connected to the energy storage unit of the other photovoltaic power generation device.
    Type: Grant
    Filed: February 3, 2021
    Date of Patent: April 16, 2024
    Assignee: HANGZHOU BINARY OPTOELECTRONICS & TECH CO., LTD.
    Inventors: Gaole Zhang, Zhixuan Zhang
  • Patent number: 11028971
    Abstract: An LED filament and lamp, and a manufacturing process of an LED filament, the LED filament includes a PCB substrate and multiple LED chips, connecting circuits are provided on the PCB substrate, a positive pin and a negative pin are provided at two ends of the connecting circuit, respectively, and each LED chip is electrically connected to the connecting circuit; and a fluorescent glue layer is provided outside the PCB substrate and the LED chips, and the positive pin and the negative pin are exposed from the fluorescent glue layer. The LED lamp includes the LED filament. The manufacturing process of an LED filament enables manufacturing an LED filament. For the LED filament and lamp, and the manufacturing process of an LED filament, a PCB substrate is used as a base material, connecting circuits are fabricated on the PCB substrate, the connecting circuits are directly used for connecting LED chips.
    Type: Grant
    Filed: April 28, 2019
    Date of Patent: June 8, 2021
    Assignee: HANGZHOU BINARY OPTOELECTRONICS & TECH CO., LTD.
    Inventors: Gaole Zhang, Kang Zhou