Abstract: The present disclosure provides an anti-PID encapsulation adhesive film, a photovoltaic module, and a photovoltaic module manufacturing method. The anti-PID encapsulation adhesive film includes a base adhesive film layer, an insulating layer, and a conductive layer. The insulating layer is located on one side surface of the base adhesive film layer. The insulating layer has a grid structure. The grid structure includes grid lines and a plurality of hollow portions defined by the grid lines. The grid lines have a structure corresponding to gaps between cell pieces. The conductive layer includes a plurality of conductive portions. The conductive portions are arranged in the hollow portions in one-to-one correspondence. The volume resistivity of the conductive portions is less than 100 ?·cm.

Abstract: Provided are a film and an electric device comprising the same. The film comprises at least one modified polyolefin resin layer. A resin forming the modified polyolefin resin layer comprises 1-100% of modified polyolefin resin. A main chain in the modified polyolefin resin is an ethylene-?-olefin copolymer. A grafted branched chain in the modified polyolefin resin is selected from a compound formed by a vinyl monomer comprising one or more of anhydride group, hydroxyl, ester group, carbonyl, acylamino, pyridyl, epoxy, pyrrolidonyl and glycidyl. A molecular weight of the grafted branched chain is 150-8000 g/mol. The film prepared from the modified POE layer with the main chain and the grafted branched chain has excellent anti-PID performance. The layers have a better adhesive property without a laminated interface therebetween. The co-extruded film further has an excellent water vapor barrier property, a relatively high insulating property and a relatively high light transmittance.

Abstract: The present disclosure discloses a low-water-vapor-permeability polyolefin-elastomer film and its preparation method. The film comprises: 50-100 mass parts of a matrix resin, 0-40 mass parts of a modified resin, 0.001-2 mass parts of an activator, 0.1-3 mass parts of an organic peroxide, 0.02-5 mass parts of an assistant cross-linker, 0.02-2 mass parts of a silane coupling agent, 0.005-2 mass parts of a light stabilizer, and 0-20 mass parts of a water blocking filler. In the present disclosure, by adding the modified resin and the activator that have an active group, a cross-linking degree and a cross-linking density of the film are improved, and a water-vapor permeability is reduced; by adding the water blocking filler, the water blocking property of the film is further improved, thereby ensuring reliability of the assembly, and prolonging service life of the assembly.

Abstract: The present disclosure relates to a high light transmittance photovoltaic encapsulating material, which is prepared by the following process: subjecting 100 mass parts of a photovoltaic encapsulating material matrix resin or a graft-modified matrix resin, 0.001 to 5 mass parts of an oxygen- or sulfur-containing compound, 0.01 to 10 mass parts of a reactive plasticize 0.01 to 1.5 mass parts of an initiator, 0.01 to 10 mass parts of an assistant cross-linker, 0.1 to 3.0 mass parts of a silane coupling agent, 0.1 to 0.4 mass parts of an ultraviolet light absorber, and 0.1 to 1.0 mass part of light stabilizer to pre-mixing, melt extrusion, film casting, cooling, slitting, and coiling. The light transmittance of the photovoltaic encapsulating material is improved, and the refractive indexes of glass/front-layer encapsulating material/cell match each other, thereby increasing the sunlight utilization ratio of a module, and optimizing the photoelectric conversion efficiency of the module.