Abstract: A light emitting diode (LED) lighting device and assembly method thereof. The LED lighting device includes: a base having a mounting surface; an LED element disposed on the mounting surface of the base; a lens component disposed at a side of the mounting surface of the base; a gasket disposed between the base and the lens component, such that the LED element is located within an area surrounded by the gasket; a fastener comprising a first portion and a second portion, wherein the first component is disposed at the side of the lens component opposite to the base and facing a portion of the lens component, the second portion extends from the first portion and is connected to the base, and the first portion of the fastener applies a pressure on the lens component towards the base.

Abstract: An LED module having a base, a lens assembly, and a light source assembly. The lens assembly has an internal thread and the base has a matching external thread. The lens assembly and base are connected by the threads to form a closed accommodating space. A sealing ring is disposed at a portion between the thread connection of the base, lens assembly, and accommodating space. The light source assembly is in the accommodating space and at one side of the base. The lens assembly and the base are in threaded connection, providing an increased force bearing surface and even force bearing therebetween, resulting in a secure connection, good leakproofness, and convenient installation and removal. The sealing ring is disposed at the connection of the lens assembly and the base, allowing for an excellent sealing effect between the lens assembly and the base.

Abstract: An LED module with high flame retardant grade includes a base, lens group, flame retardant film and at least one LED luminary unit. The flame retardant film is provided on a first side of the base with at least one hole on the flame retardant film. The LED luminary unit is provided on the first side of the base and passes through the hole with the lens group being covered onto the first side of the base. A first closed space is formed between the lens group and base. The flame retardant film can effectively cut off circuit sparks generated by a circuit layer or by a PCB board on the base, effectively reducing security risks. The module has a high flame retardant grade after being provided with the flame retardant film and the LED module has a simple structure and is easy to process and implement.

Abstract: A sealing process of LED modules, comprising: (1) a waterproof wire goes through a wire-through hole of a heat sink to be connected with a positive-negative solder joints on a PCB board, wherein the positive-negative solder joint and the position that the waterproof wire going through are subjected to glue sealing treatment, and a waterproof sealing process is operated between the waterproof wire and the wire-through hole; (2) fix the PCB board on the heat sink; (3) place one sealing ring into one of the grooves; (4) apply evenly a ring of liquid silica gel along the other groove of the lens set and the amount of the liquid silica gel is limited to completely sticking the solid silica gel sealing ring; (5) the heat sink installed with the PCB board and the waterproof wire as processed in step (2) is inversely buckled on the lens set which is set with the solid silica gel ring and the liquid silica gel as processed in step (4), so as to fix the heat sink entirety and the lens set.

Abstract: A LED module includes a lens group, an LED illuminant, a circuit board and a heat sink; the LED illuminant includes an LED chip and a heat sink holder; the LED chip is attached to the heat sink holder which is disposed on the circuit board by Surface Mounted Technology; the lens group covers the heat sink, and is located above the LED chip; encapsulant is filled in a confined space formed between the lens group and the heat sink through a process of injection. Compared with the prior art, in the LED module of the present invention, the encapsulant replaces the original air medium in the transmission process of the light emitted by the LED chip; moreover, matching between the refractive index of the encapsulant and the lens of the lens group improves the light out-coupling efficiency. Lighting efficiency is improved by 10˜15% compared with the prior art.

Abstract: An LED lighting device is provided, having a lamp housing and at least one LED module. The lamp housing has a lamp cover and a housing-type heat-dissipating lamp bracket that directly radiates the heat generated by the LED module. The housing-type heat-dissipating lamp bracket is entirely made of heat-dissipating material, and several radiating hole devices are set on the housing-type heat-dissipating lamp bracket. The radiating hole devices on the housing-type heat-dissipating lamp bracket and the gaps between the LED modules form a mutually-reinforcing thermal honeycomb effect, providing a heat dissipation channel with unhindered air convection. Radiating holes are set at the head and tail of the housing-type heat-dissipating lamp bracket. The radiating holes and the gaps between the modules enhance the heat-dissipating effect and enhance air convection, to improve heat dissipation from the lamp housing and provide improved heat dissipation effect for the entire lamp.

Abstract: A lamp-housing-type heat-sink in an LED lighting device is provided, which is a hollow middle part formed monolithically by extending a high purity aluminum plate with a thickness of 0.5 mm to 5 mm and an aluminum content of above 95%. The heat-sink has a heat-sinking surface and housing body. A surface contact structure is formed between the heat-sinking surface and a circuit board, and several radiating holes are set on the housing body to form heat dissipation channels. A method for manufacturing the lamp-housing-type heat-sink in LED lighting device is also provided. The lamp-housing-type heat-sink uses fewer materials and costs less than conventional die-cast aluminum housing, while providing a higher thermal conductivity co-efficient.

Abstract: A sealing process of LED modules includes a waterproof wire put through a wire-through hole of a heat sink to be connected with a positive-negative solder joints on a PCB board, which are subjected to glue sealing treatment. A waterproof sealing process is operated between the waterproof wire and wire-through hole. The PCB board is fixed on the heat sink. One sealing ring is placed into a groove. A ring of liquid silica gel is evenly applied along the other groove. The heat sink installed with the PCB board and the waterproof wire are inversely buckled on the lens set which is fixed with the solid silica gel ring and liquid silica gel. At least two waterproof sealing rings are used to isolate an LED chip from the outside so as to prevent all water vapor or other harmful gases from corroding the chip and the PCB.

Abstract: The present invention relates to the technical field of illuminating lamp, especially to an LED module and its manufacturing process. The LED module of the present invention includes a lens group, an LED illuminant, a circuit board and a heat sink; the LED illuminant includes an LED chip and a heat sink holder; the LED chip is attached to the heat sink holder which is disposed on the circuit board by Surface Mounted Technology; the lens group covers the heat sink, and is located above the LED chip; encapsulant is filled in a confined space formed between the lens group and the heat sink through a process of injection. Compared with the prior art, in the LED module of the present invention, the encapsulant replaces the original air medium in the transmission process of the light emitted by the LED chip; moreover, the matching between the refractive index of the encapsulant and the lens of the lens group improves the light out-coupling efficiency to greatest extent.