Patents Assigned to Hanmi Semiconductor Co., Ltd.
  • Sawing Apparatus and a Control Method for Manufacturing Processes of Semiconductor Package
    Publication number: 20070259483
    Abstract: Disclosed is a sawing apparatus for manufacturing a semiconductor package, capable of simultaneously performing strip loading work and package unloading work during the sawing process to improve productivity of the semiconductor packages.
    Type: Application
    Filed: August 31, 2004
    Publication date: November 8, 2007
    Applicant: Hanmi Semiconductor Co., Ltd.
    Inventor: Yong-Goo Lee