Patents Assigned to HANNANOTECH CO., LTD.
  • Patent number: 11292170
    Abstract: The present invention relates to a processing aid of a non-fluorinated melt-processable polymer and a masterbatch for a processing aid, features the inclusion of a processing aid comprising a fluoropolymer forming clustered secondary particles each having a particle size of 2 ?m to 2 mm and being a combination of primary fluoropolymer particles each having a diameter of 0.02 ?m to 0.5 ?m, and may accelerate the elimination of melt fracture despite the omission of an interfacial agent and decrease extrusion load upon process to thereby enhance productability.
    Type: Grant
    Filed: January 9, 2020
    Date of Patent: April 5, 2022
    Assignee: HANNANOTECH CO., LTD.
    Inventors: Soo Wan Kim, Eun Kyoung Kim, Dae Ho Lee
  • Publication number: 20130122219
    Abstract: An electrically conductive polymer filler for preparing electrically conductive plastics and a preparation method thereof. More specifically, the invention relates to an electrically conductive polymer filler comprising carbon nanotube (CNT) microcapsules including carbon nanotubes encapsulated with a thermoplastic resin layer, and to a preparation method and an electrically conductive thermoplastic resin comprising the electrically conductive polymer filler.
    Type: Application
    Filed: January 4, 2013
    Publication date: May 16, 2013
    Applicant: HANNANOTECH CO., LTD.
    Inventor: HANNANOTECH CO., LTD.
  • Publication number: 20120298925
    Abstract: The present invention relates to an electrically conductive polymer filler for preparing electrically conductive plastics and a preparation method thereof. More specifically, the invention relates to an electrically conductive polymer filler comprising carbon nanotube (CNT) microcapsules including carbon nanotubes encapsulated with a thermoplastic resin layer, and to a preparation method and an electrically conductive thermoplastic resin comprising the electrically conductive polymer filler.
    Type: Application
    Filed: December 14, 2011
    Publication date: November 29, 2012
    Applicant: HANNANOTECH CO., LTD.
    Inventors: Soowan Kim, Sangpil Kim, Changwon Lee