Abstract: A power control system includes electronic component mounting apparatuses; power control modules configured to control power of the electronic component mounting apparatuses; a power controller configured to turn on and off the power of the electronic component mounting apparatuses by controlling the power control modules, or receive signals from the power control modules indicating power on and off states of the electronic component mounting apparatuses; and a remote control module that is remote from the electronic component mounting apparatuses and is configured to control the power of electronic component mounting apparatuses by controlling the power controller via a wired or wireless connection.

Abstract: Provided are a bonding apparatus and a method of controlling the bonding apparatus. The bonding apparatus includes a bonding head, a wafer chuck configured to receive a wafer thereon, and at least one bonding stage cover disposed above the wafer chuck.

Abstract: Provided is a bonding apparatus including a first wafer supplier including a plurality of load ports configured to store wafers having different sizes, the wafers including a plurality of substrate wafers and a plurality of die supply wafers, a first transferer adjacent to the first wafer supplier and configured to transfer the wafers, a first bonding device and a second bonding device facing the first wafer supplier, and configured to receive the wafers from the first wafer supplier and perform bonding, and a first cleaner comprising a plurality of cleaning areas, each of which is configured to receive the plurality of substrate wafers and the plurality of die supply wafers by the first transferer, and clean the plurality of substrate wafers and the plurality of die supply wafers.

Abstract: Provided is a hybrid bonding apparatus including a plurality of chambers, and a transferer configured to transfer a plurality of wafers between the plurality of chambers and transfer a plurality of bonded wafers to an annealing chamber, the plurality of wafers including a plurality of substrate wafers and a plurality of die supply wafers, wherein the plurality of chambers respectively includes a wafer supplier configured to store the plurality of wafers, a bonding device configured to bond the plurality of wafers, the bonding device including a bonder configured to bond dies on the plurality of substrate wafers from the plurality of die supply wafers, and a pre-annealing oven configured to primarily anneal the plurality of substrate wafers, and a processor.

Abstract: A machine tool having a separately replaceable tool post is provided. The machine tool includes supports that are facing each other with an axis line of a main axis in an axial direction therebetween; a rotation tool post detachably connected on one of the supports and rotatable with respect to a first direction perpendicular to the axis line; a fastening member detachably connecting the rotation tool post on the one of the supports, wherein the rotation tool post includes: a rotation unit configured to rotate in the first direction on the one of the supports; an upper fastening unit at an upper portion of the rotation unit, and detachably fastened to the one of the supports; and a lower fastening unit at a lower portion of the rotation unit, and detachably fastened to the one of the supports so that the rotation unit is rotatable.

Abstract: A component mounting apparatus includes a component mounting unit including a suction configured to adsorb and transport a component; a first light source configured to emit first light to the component; a second light source configured to emit second light to a Fiducial mark of a substrate; a filter configured to transmit the first light reflected by the component through the filter and reflect the second light reflected by the Fiducial mark; and an image capturer configured to detect the first light transmitted through the filter and the second light reflected by the filter.

Abstract: A component pickup apparatus includes a component pickup unit including a plurality of nozzles, each of the plurality of nozzles configured to adsorb a component; a light emitter configured to emit light toward the plurality of nozzles; an image splitter configured to receive an image of the plurality of nozzles generated by the light and configured to split the image of the plurality of nozzles into different groups; and an image capturer configured to capture an image outputted from the image splitter. The image splitter is configured to guide a first image of a first group of the plurality of nozzles to a first row of the image capturer and guide a second image of a second group of the plurality of nozzles to a second row of the image capturer.

Abstract: An object detection method includes: step (a1), a control device obtains an image and an outline of a specific object; step (a2), the control device obtains reference position information with respect to the center position of the specific object in the image; step (b1), the control device detects the outline of an unknown object from an image of the unknown object; step (b2), the control device obtains patch images including a region of the outline of the unknown object, by means of the reference position information; and step (b3), the control device determines whether the specific object exists in the image of the unknown object, by means of the similarity of the shape of the outline of the unknown object with respect to the shape of the outline of the specific object and the similarity of each of the patch images with respect to the image of the specific object.

Abstract: A robot control system includes: an interface configured to receive a user input; a controller configured to generate a motion command corresponding to the user input and a motion command group including the motion command, and generate hardware interpretable data by analyzing the motion command; and a driver configured to drive a motion of at least one hardware module based on the hardware interpretable data to be interpreted by the at least one hardware module.

Abstract: As a preferred embodiment of the present invention, a device for controlling a collaborative robot includes a collision detection unit configured to sense a collision of the collaborative robot; a control unit configured to control an operation mode of the collaborative robot when the collision detection unit senses the collision; and a collision countermeasure unit configured to apply, when the collision detection unit senses the collision, a collision compensation value to each of a plurality of joints in the collaborative robot so as to change a proceeding direction of a force applied to the each of the plurality of joints.

Abstract: A method of processing control signals using a plurality of ports of a robot control device is provided. The method may include determining a logic signal of each of the plurality of ports corresponding to an N-bit signal frame; generating a port setting bit for determining whether to use each of the plurality of ports corresponding to the N-bit signal frame based on an order of the plurality of ports; generating a result bit by performing a bit operation on the logic signal of each of the plurality of ports and the port setting bit; and processing a first signal based on the result bit.

Abstract: A method of teaching a robot capable of maintaining constant a direction in which an end faces and including N joints (N is a natural number) according to an embodiment of the present disclosure includes: obtaining a reference direction in which the end is to face; calculating angles of M joints (M is a natural number, and N>M) from among the N joints to correspond to teaching of a user with respect to the robot; and calculating angles of remaining joints so that the end faces in the reference direction, based on the angles of the M joints. In this case, the remaining joints may be joints other than the M joints from among the N joints.

Abstract: Provided are a carrier tape feeding device, a chip mounting system, and a chip mounting method. The carrier tape feeding device includes: a transfer unit for transferring a first carrier tape and a second carrier tape sequentially to a chip mounting apparatus; a rotation unit selectively engaged to a part of the first carrier tape with which a part of the second carrier tape contacts, and for transferring the second carrier tape to the transfer unit; a detecting sensor unit for detecting sequential existence of the first carrier tape or the second carrier tape supplied to the transfer unit, and existence of the second carrier tape supplied to the rotation unit; and a controller for determining existence of the first carrier tape based on a signal detected by the detecting sensor unit, and controlling at least one of the transfer unit and the rotation unit to be driven based on the existence of the first carrier tape.

Abstract: Provided is a component loading apparatus which includes: a work table comprising a working plane; a component recognizer configured to recognize components placed on the working plane of the work table; a head configured to suck the components; and a tray support for supporting a tray on which the components sucked by the head are loaded. The component loading apparatus further includes: an impurity remover configured to remove impurities attached onto the components in at least one of a first state of being placed on the working plane of the work table and a second state of being sucked by the head; and a tray analyzer configured to inspect loading positions of the components on the tray.

Abstract: A method of controlling a robot includes: generating a plurality of behavior objects corresponding to a plurality of behaviors to be performed by the robot; calculating an expected time expected to be taken by the robot to perform each of the behaviors; mapping each of the behavior object to the expected time; adding the behavior objects to a behavior flow list; and displaying the behavior flow list.

Abstract: A component mounting apparatus includes a component mounting unit including a suction configured to adsorb and transport a component; a first light source configured to emit first light to the component; a second light source configured to emit second light to a Fiducial mark of a substrate; a filter configured to transmit the first light reflected by the component through the filter and reflect the second light reflected by the Fiducial mark; and an image capturer configured to detect the first light transmitted through the filter and the second light reflected by the filter.

Abstract: A component pickup apparatus includes a component pickup unit including a plurality of nozzles, each of the plurality of nozzles configured to adsorb a component; a light emitter configured to emit light toward the plurality of nozzles; an image splitter configured to receive an image of the plurality of nozzles generated by the light and configured to split the image of the plurality of nozzles into different groups; and an image capturer configured to capture an image outputted from the image splitter. The image splitter is configured to guide a first image of a first group of the plurality of nozzles to a first row of the image capturer and guide a second image of a second group of the plurality of nozzles to a second row of the image capturer.

Abstract: An apparatus for controlling a robot arm includes: the robot arm; a calibration board on which calibration marks for self-diagnosis are shown; a distance sensor mounted on the robot arm and configured to measure a distance; an image sensor mounted on the robot arm and configured to obtain an image; and a processor configured to move the robot arm to a position for the self-diagnosis, measure a distance from a predetermined part of the robot arm to the calibration board by using the distance sensor, obtain an image of the calibration board by using the image sensor, and output a signal indicating a malfunction of the robot arm in response to the measured distance being outside a distance error range, and an image measurement value of the obtained image being outside an image error range.

Abstract: A facility abnormality prediction model generation system includes: a data receiver receiving data of sensors of a facility previously obtained during an operation of the facility; an abnormality notification time predictor detecting a malfunction time of a malfunction of the facility based on the data of the sensors and determining an abnormality notification time for pre-notification of the malfunction of the facility based on the detected malfunction time; an optimal sensor combination calculator generating a chromosome based on the data of the sensors and performing a genetic algorithm using the generated chromosome to calculate an optimal sensor combination which is a combination of sensor data related to the determined abnormality notification time; and a facility abnormality prediction model generator generating a facility abnormality prediction model for the pre-notification of the malfunction of the facility, based on the optimal sensor combination.

Abstract: A manufacturing process visualization apparatus is provided. The apparatus includes: at least one processor configured to implement: a data receiving unit which receives apparatus data from at least one production apparatus of a manufacturing process line processing a plurality of products; and a matching unit which extracts product record information about each of the products from the received apparatus data, classifies the extracted product record information as information corresponding to specific product flow properties of the manufacturing process line, generates product flow information indicating the specific product flow properties by using the classified product record information, and generates graphic process information about the manufacturing process line in which the product flow information about each product is represented in graphics; and a screen display which displays the generated graphic process pattern information on a screen.