Patents Assigned to Hanyang Chemical Ind., Co.
  • Palladium alloy plating compositions
    Patent number: 5552031
    Abstract: A palladium alloy plating composition comprising 4 to 20 g/l of palladium ion, 0.3 to 2.0 g/l of gold ion, 5 to 100 g/l of a conductive salt and 0.5 to 20 g/l of a complexing agent, and optionally 0.3 to 5 g/l of an alloying metal ion provides a plating with an excellent solderability and flexibility onto a substrate by an electrical plating method.
    Type: Grant
    Filed: February 21, 1995
    Date of Patent: September 3, 1996
    Assignee: Hanyang Chemical Ind., Co.
    Inventor: Sung S. Moon