Patents Assigned to HappyJapan Inc.
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Publication number: 20230148929Abstract: A wearable device includes a biomedical electrode that can be placed on the target living subject for measurement and that detects the bioelectric potential according to the electric current coming from the target living subject for measurement; and a detection circuit that detects biological signals from the detected bioelectric potential. The biomedical electrode includes an elastic body that has a frame member having an opening and nonconductive; and includes a conductive fiber that is placed on the surface of the elastic body and that detects the bioelectric potential according to the electric current coming from the target living subject for measurement.Type: ApplicationFiled: November 15, 2022Publication date: May 18, 2023Applicant: HappyJapan Inc.Inventors: Kenichi Mori, Masayoshi Yokoo, Kenji Seino
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Patent number: 10527669Abstract: An IC device 4 of the present invention includes a robot arm 6 for conveying IC devices D to a test head 2 for testing the IC devices. The test head 2 includes sockets 3 having placement surfaces 3a onto which the IC devices D are placed and for attaching the IC devices placed on the placement surfaces to the test head. The robot arm 6 includes a contact head 61 for holding the IC devices while the IC devices are conveyed and for pressing the IC devices onto the test head during testing, and a non-contact displacement meter 71 that moves in association with the movement of the contact head 61. The non-contact displacement meter 71 is mounted on the robot arm 6 so as to measure a distance by emitting a beam in a direction perpendicular to the placement surfaces 3a.Type: GrantFiled: August 31, 2015Date of Patent: January 7, 2020Assignee: HappyJapan, Inc.Inventors: Shouhei Matsumoto, Shinichi Hasebe, Mitsuo Koizumi, Yoshinori Arai, Masayoshi Yokoo, Keitaro Harada
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Patent number: 10473715Abstract: An IC handler (4) of the present invention is provided with: a contact head (7), which holds a plurality of IC devices, and which presses the IC devices to a plurality of sockets (3); and a movable arm (6) that moves the contact head (7). The movable arm (6) has power supply ports (VO, HO) that are connected to supply sources (VS, HS) of power for generating operations of the contact head (7), and the contact head (7) has a plurality of operating sections (70) that operate with the power, and a supporting section (71), which supports the operating sections (70), and which is removably attached to the movable arm (6). The supporting section (71) of the contact head (7) has: connecting ports (VC, HC) that are removably connected to the supply ports (VO, HO); and supply paths (71a, 71d) for supplying the power to the operating sections (70) from the connecting ports (VC, HC) connected to the supply ports (VO, HO).Type: GrantFiled: December 3, 2013Date of Patent: November 12, 2019Assignee: HappyJapan Inc.Inventors: Shouhei Matsumoto, Yoshinori Arai, Satoshi Ueno, Keitaro Harada, Masayoshi Yokoo
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Patent number: 10222413Abstract: An IC handler (4) of the present invention transfers an IC device (D) to a test head (2). The test head (2) is provided with a socket (3), which has a placing surface (3a) having the IC device (D) placed thereon, and which attaches the IC device (D) placed on the placing surface (3a) to the test head (2). The IC handler (4) is provided with a non-contact displacement meter (71) that is disposed by being spaced apart from the socket (3) in the direction perpendicular to the placing surface (3a). The non-contact displacement meter (71) measures a distance from the non-contact displacement meter (71) to the IC device (D) placed on the placing surface (3a) by emitting a laser beam toward the placing surface (3a) of the socket (3).Type: GrantFiled: December 3, 2013Date of Patent: March 5, 2019Assignee: HappyJapan Inc.Inventors: Shouhei Matsumoto, Mitsuo Koizumi, Fumiaki Togashi, Satoshi Ueno, Keitaro Harada, Masayoshi Yokoo