Patents Assigned to HarcoSemco, LLC
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Publication number: 20240343411Abstract: Provided is a thermocouple wire harness including a first branch, a second branch extending about ninety degrees from the first branch in a first direction and having a first pair of thermocouple terminal breakouts extending therefrom for coupling to a first thermocouple, and a third branch extending about ninety degrees from the first branch in a second direction opposite the first direction, the third branch having a second pair of thermocouple terminal breakouts extending therefrom for coupling to a second thermocouple, a third pair of thermocouple terminal breakouts extending therefrom for coupling to a third thermocouple, and a fourth pair of thermocouple terminal breakouts extending therefrom for coupling to a fourth thermocouple.Type: ApplicationFiled: April 15, 2024Publication date: October 17, 2024Applicant: HarcoSemco LLCInventors: Thomas Bieluch, John Dutra
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Patent number: 12078552Abstract: An optimized thermocouple system and a method of optimizing a thermocouple system having a plurality of thermocouple probes and a junction box is provided and includes examining the thermocouple system to identify a first thermocouple probe of the plurality of thermocouple probes, wherein the first thermocouple probe includes a first positive leg and a first negative leg and is located electrically farthest from the junction box. The method includes calculating a first loop resistance between the first thermocouple probe and the junction box and configuring a second thermocouple probe of the plurality of thermocouple probes having a second positive leg, a second negative leg and a second loop resistance such that the second loop resistance is substantially equal to the first loop resistance.Type: GrantFiled: November 15, 2022Date of Patent: September 3, 2024Assignee: HarcoSemco, LLCInventor: Igor Giterman
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Publication number: 20240239276Abstract: Provided is a transition assembly for a wire harness configured to be coupled to a plate in an aircraft. The transition assembly includes a slotted flange configured to abut a first side of the plate, a junction having a flange configured to abut a second side of the plate, the flange including inwardly extending cutouts on opposite sides thereof forming a reduced width portion of the flange, and a nut configured to couple to the junction.Type: ApplicationFiled: January 13, 2023Publication date: July 18, 2024Applicant: HarcoSemco, LLCInventors: Mark Jaeger, William Hinman
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Publication number: 20240159601Abstract: A Mass Flow Sensor (MFS) is provided and includes an MFS housing, a mounting structure, having a mounting structure top and a mounting structure bottom, wherein the MFS housing is associated with the mounting structure top, a first sensor leg, wherein the first sensor leg extends away from the mounting structure bottom and includes a first temperature measurement device and a heating element. The MFS further includes a second sensor leg, wherein the second sensor leg extends away from the mounting structure and includes a second temperature measurement device and an airfoil structure, wherein the airfoil structure defines an airfoil cavity and is associated with the mounting structure bottom to contain the first sensor leg and the second sensor leg.Type: ApplicationFiled: November 14, 2023Publication date: May 16, 2024Applicant: HarcoSemco LLCInventors: Igor Giterman, Robert A. Croce, JR.
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Publication number: 20240011843Abstract: Provided is a backshell assembly including a backshell housing having a first end, a second end, a passage extending therebetween, and a radial groove in the passage, a connector coupled to the first end of the backshell housing, a header assembly disposed in the passage of the backshell housing, the header assembly including a header body, an insulating core disposed within the header body and including a plurality of openings, and a plurality of tubes extending through a respective one of the plurality of openings, and a seal disposed in the radial groove and surrounding the header body to seal the backshell housing to the header body.Type: ApplicationFiled: July 7, 2023Publication date: January 11, 2024Applicant: HarcoSemco LLCInventor: William H. Hinman
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Patent number: 11846549Abstract: A Mass Flow Sensor (MFS) is provided and includes an MFS housing, a mounting structure, having a mounting structure top and a mounting structure bottom, wherein the MFS housing is associated with the mounting structure top, a first sensor leg, wherein the first sensor leg extends away from the mounting structure bottom and includes a first temperature measurement device and a heating element. The MFS further includes a second sensor leg, wherein the second sensor leg extends away from the mounting structure and includes a second temperature measurement device and an airfoil structure, wherein the airfoil structure defines an airfoil cavity and is associated with the mounting structure bottom to contain the first sensor leg and the second sensor leg.Type: GrantFiled: September 14, 2020Date of Patent: December 19, 2023Assignee: HarcoSemco LLCInventors: Igor Giterman, Robert A. Croce, Jr.
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Publication number: 20230078435Abstract: An optimized thermocouple system and a method of optimizing a thermocouple system having a plurality of thermocouple probes and a junction box is provided and includes examining the thermocouple system to identify a first thermocouple probe of the plurality of thermocouple probes, wherein the first thermocouple probe includes a first positive leg and a first negative leg and is located electrically farthest from the junction box. The method includes calculating a first loop resistance between the first thermocouple probe and the junction box and configuring a second thermocouple probe of the plurality of thermocouple probes having a second positive leg, a second negative leg and a second loop resistance such that the second loop resistance is substantially equal to the first loop resistance.Type: ApplicationFiled: November 15, 2022Publication date: March 16, 2023Applicant: HarcoSemco, LLCInventor: Igor Giterman
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Patent number: 11525741Abstract: An optimized thermocouple system and a method of optimizing a thermocouple system having a plurality of thermocouple probes and a junction box is provided and includes examining the thermocouple system to identify a first thermocouple probe of the plurality of thermocouple probes, wherein the first thermocouple probe includes a first positive leg and a first negative leg and is located electrically farthest from the junction box. The method includes calculating a first loop resistance between the first thermocouple probe and the junction box and configuring a second thermocouple probe of the plurality of thermocouple probes having a second positive leg, a second negative leg and a second loop resistance such that the second loop resistance is substantially equal to the first loop resistance.Type: GrantFiled: April 21, 2022Date of Patent: December 13, 2022Assignee: HarcoSemco LLCInventor: Igor Giterman
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Publication number: 20220260430Abstract: An optimized thermocouple system and a method of optimizing a thermocouple system having a plurality of thermocouple probes and a junction box is provided and includes examining the thermocouple system to identify a first thermocouple probe of the plurality of thermocouple probes, wherein the first thermocouple probe includes a first positive leg and a first negative leg and is located electrically farthest from the junction box. The method includes calculating a first loop resistance between the first thermocouple probe and the junction box and configuring a second thermocouple probe of the plurality of thermocouple probes having a second positive leg, a second negative leg and a second loop resistance such that the second loop resistance is substantially equal to the first loop resistance.Type: ApplicationFiled: June 28, 2021Publication date: August 18, 2022Applicant: HarcoSemco, LLCInventor: Igor Giterman
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Patent number: 11415472Abstract: A sensor circuit architecture includes a Wheatstone bridge-type sensing element that includes a plurality of resistors and a plurality of equivalent compensation networks. Each of the plurality of resistors includes one of the plurality of equivalent compensation networks. Each of the plurality of equivalent compensation networks includes at least one digital resistive compensation network configured to provide at least one of the following: variable resistance, digitally controlled variable resistance, digitally controlled resistance, and/or digitally set resistance. The sensor circuit architecture is configured with the at least one digital resistive compensation network to implement at least one of the following: a desired scale of output, a desired offset compensation, and/or a desired temperature compensation.Type: GrantFiled: June 10, 2020Date of Patent: August 16, 2022Assignee: HARCOSEMCO LLCInventor: Robert A. Croce, Jr.
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Publication number: 20220244110Abstract: An optimized thermocouple system and a method of optimizing a thermocouple system having a plurality of thermocouple probes and a junction box is provided and includes examining the thermocouple system to identify a first thermocouple probe of the plurality of thermocouple probes, wherein the first thermocouple probe includes a first positive leg and a first negative leg and is located electrically farthest from the junction box. The method includes calculating a first loop resistance between the first thermocouple probe and the junction box and configuring a second thermocouple probe of the plurality of thermocouple probes having a second positive leg, a second negative leg and a second loop resistance such that the second loop resistance is substantially equal to the first loop resistance.Type: ApplicationFiled: April 21, 2022Publication date: August 4, 2022Applicant: HarcoSemco, LLCInventor: Igor Giterman
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Publication number: 20210164846Abstract: An optimized thermocouple system and a method of optimizing a thermocouple system having a plurality of thermocouple probes and a junction box is provided and includes examining the thermocouple system to identify a first thermocouple probe of the plurality of thermocouple probes, wherein the first thermocouple probe includes a first positive leg and a first negative leg and is located electrically farthest from the junction box. The method includes calculating a first loop resistance between the first thermocouple probe and the junction box and configuring a second thermocouple probe of the plurality of thermocouple probes having a second positive leg, a second negative leg and a second loop resistance such that the second loop resistance is substantially equal to the first loop resistance.Type: ApplicationFiled: February 15, 2021Publication date: June 3, 2021Applicant: HarcoSemco, LLCInventor: Igor Giterman
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Patent number: 10921196Abstract: An optimized thermocouple system and a method of optimizing a thermocouple system having a plurality of thermocouple probes and a junction box is provided and includes examining the thermocouple system to identify a first thermocouple probe of the plurality of thermocouple probes, wherein the first thermocouple probe includes a first positive leg and a first negative leg and is located electrically farthest from the junction box. The method includes calculating a first loop resistance between the first thermocouple probe and the junction box and configuring a second thermocouple probe of the plurality of thermocouple probes having a second positive leg, a second negative leg and a second loop resistance such that the second loop resistance is substantially equal to the first loop resistance.Type: GrantFiled: February 24, 2017Date of Patent: February 16, 2021Assignee: HarcoSemco, LLCInventor: Igor Giterman