Abstract: A micro LED selective air layer transfer print device, includes: a laser light source part which irradiates laser light; a wafer part which is located under the laser light source part to receive the laser light irradiated from the laser light source part; and a glass substrate part, which is located under the wafer part and onto which micro LED chips of the wafer part are transferred, wherein the glass substrate part includes: a substrate stage which is located under the wafer part; and a substrate lift part which lifts the whole substrate stage or only a portion of the substrate stage.

Abstract: A micro LED chip transfer method includes: determining the transfer object size for a transfer, by using a block-by-block LED chip map in which the use state information of an LED chip is stored for each block of the wafer; determining a mask size that can minimize a scrap block of the wafer that is not used for transfer, by using the transfer object size; determining a starting point position of the wafer transfer object region for transfer; and positioning a mask having the mask size at the starting point position of the wafer transfer object region and irradiating a laser, such that the LED chip formed in the wafer transfer object region is transferred.

Abstract: A micro-LED manufacturing device includes: a wafer stage on which a wafer is positioned; a substrate stage on which a substrate is positioned; a lower base formed below the substrate stage; a first driving member formed on the substrate stage so as to move the wafer stage; and a second driving member formed on the lower base so as to move the substrate stage. The micro-LED manufacturing device is formed such that the wafer stage moves over the substrate stage, and thus the substrate stage and the wafer stage can move synchronously with respect to the lower base.