Patents Assigned to HARMAN INTERNATIONAL INDUSTRIES, INCORORATED
  • Headphones with thermal control
    Patent number: 9942647
    Abstract: The various embodiments set forth a headphone apparatus that includes a first earcup, a sensor included in the first earcup, and a controller. The first earcup is coupled to a headband, and includes a loudspeaker system and a thermal control subsystem. The controller is configured to detect an output generated by the sensor, and, based on the output, transmit a signal to the thermal control subsystem included in the first earcup to modify a temperature associated with at least the first earcup.
    Type: Grant
    Filed: October 2, 2015
    Date of Patent: April 10, 2018
    Assignee: HARMAN INTERNATIONAL INDUSTRIES, INCORORATED
    Inventors: Davide Di Censo, Stefan Marti, Jaime Elliot Nahman