Abstract: A low profile mount for a disc varistor. A thermally sensitive switch is provided both for single and multiple electrode embodiments. The switch may be placed in a shorting circuit and include a spring biased conductor prevented from closure by a heat sensitive element which softens in responsive to excessive heat. The varistor may be fused to prevent excessive current from a short circuited but not open circuited varistor. Methods are also provided.
Abstract: A method of providing nickel barrier end terminations for a zinc oxide semiconductor device with exposed body surfaces and end terminal regions, in which the device is controllably reacted with a nickel plating solution only on an exposed end terminal region and thereafter provided with a final tin or tin-lead termination.
Type:
Application
Filed:
December 18, 2000
Publication date:
May 2, 2002
Applicant:
Harris Ireland Development Company, Ltd.
Abstract: A low profile mount for a disc varistor. A thermally sensitive switch is provided both for single and multiple electrode embodiments. The switch may be placed in a shorting circuit and include a spring biased conductor prevented from closure by a heat sensitive element which softens in responsive to excessive heat. The varistor may be fused to prevent excessive current from a short circuited but not open circuited varistor. Methods are also provided.
Abstract: A low profile mount for a disc varistor. A thermally sensitive switch is provided both for single and multiple electrode embodiments. The switch may be placed in a shorting circuit and include a spring biased conductor prevented from closure by a heat sensitive element which softens in responsive to excessive heat. The varistor may be fused to prevent excessive current from a short circuited but not open circuited varistor. Methods are also provided.
Type:
Grant
Filed:
September 22, 1999
Date of Patent:
October 16, 2001
Assignee:
Harris Ireland Development Company, Ltd.
Abstract: A low profile mount for a disc varistor. A thermally sensitive switch is provided both for single and multiple electrode embodiments. The switch may be placed in a shorting circuit and include a spring biased conductor prevented from closure by a heat sensitive element which softens in responsive to excessive heat. The varistor may be fused to prevent excessive current from a short circuited but not open circuited varistor. Methods are also provided.
Type:
Application
Filed:
April 27, 2001
Publication date:
August 23, 2001
Applicant:
Harris Ireland Development Company Ltd.
Abstract: A low profile mount for a disc varistor. A thermally sensitive switch is provided both for single and multiple electrode embodiments. The switch may be placed in a shorting circuit and include a spring biased conductor prevented from closure by a heat sensitive element which softens in responsive to excessive heat. The varistor may be fused to prevent excessive current from a short circuited but not open circuited varistor. Methods are also provided.
Type:
Application
Filed:
April 27, 2001
Publication date:
August 23, 2001
Applicant:
Harris Ireland Development Company Ltd.
Abstract: A low profile mount for a disc varistor. A thermally sensitive switch is provided both for single and multiple electrode embodiments. The switch may be placed in a shorting circuit and include a spring biased conductor prevented from closure by a heat sensitive element which softens in responsive to excessive heat. The varistor may be fused to prevent excessive current from a short circuited but not open circuited varistor. Methods are also provided.
Type:
Application
Filed:
April 27, 2001
Publication date:
August 23, 2001
Applicant:
Harris Ireland Development Company Ltd.
Abstract: A method for minimizing leakage currents in electrical devices with ceramic bodies. An electrical device that includes a ceramic body with electrically conductive terminations and is provided with a protective sealant to prevent flux penetration during the subsequent soldering of the device into an electrical circuit. The method includes coating the device in a fluorinated polymer which inhibits flux penetration of the ceramic body during soldering of the terminals without interfering with the soldering process.
Type:
Grant
Filed:
July 26, 1999
Date of Patent:
August 21, 2001
Assignee:
Harris Ireland Development Company, Ltd.