Abstract: A surface mounted LED package includes a pair of metal contact plates, an LED mounted to one (or both) metal contact plates, and glue encapsulating the LED and holding the LED and both metal contact plates together to form a LED package to be soldered to a motherboard. The contact plates have side notches and bottom recesses of various shapes and dimensions, as well as through holes extending through the entire width of the contact plates to facilitate the glue flow for filling out the side notches and bottom recesses for improved solidifying of the LED package. The contact plates have portions uncovered by the glue to provide extended areas for soldering to a motherboard.

Abstract: An image sensor chip is mounted on a printed wiring frame over a substrate, which is plated with a spider web of plated conductors connecting the chip through plated through conduit which wraps around the edge of the substrate to form pads at the bottom of the substrate as output terminals for connection to a printed circuit board. After wiring bonding the chip to the plated conductor, the package is sealed. The structure is amenable to mass production. A large number of printed wiring frames are arranged as a matrix on a common substrate The frames are sealed column by column or sealed all at once. After sealing, the common substrate are diced into individual packages. The image sensor package may mounted with integrated circuit chips as peripheral circuits. The image sensor chips may be sealed with transparent glue and the integrated circuit chip may be sealed with opaque glue.

Abstract: Stacked metal sections serve as two leads of an IC package. In one embodiment, an IC chip is mounted on one section serving as the terminal for the bottom electrode of the chip, and the top electrode of the chip is wire-bonded to the other section serving as another terminal for the chip. The thin sheet metal permits narrower etched separation between the two metal sections. Stacking of two pre-etched thin sheet metals strengthens the substrate. The package is covered with glue to hold the two sections together. The stacked pre-etched metal sheets can serve as a common substrate for a matrix of IC packages, which can later be cut in two orthogonal directions to yield individual packages.

Abstract: The LEDs of a display panel are arranged in a matrix array and oriented at an angle with the directions of columns or rows. Such an orientation causes the diffused light incident on neighboring LEDs of activated LEDs to create a shaded area with the same aspect ratio of the activated pattern and to yield a virtual stereoscope illusion.

Abstract: An array of light emitting diodes (LED) are laid out as a dot matrix array as a display panel. Each LED is accessed by two dimensional addressing from a first set of parallel horizontal interconnections and a second set of orthogonal interconnections. The two sets of orthogonal interconnections are printed on two sides of a substrate. One of the two electrodes of an LED, which mounted on the top of the substrate, is fed through the substrate with a via hole and connected to the orthogonal interconnection at the bottom of the substrate. The size of the display panel is configurable by removing certain rows and/or columns. More than one partitioned blocks can be pieced together by aligning and coupling the corresponding orthogonal interconnections through a motherboard.

Abstract: A surface-mount package for multiple LED chips is constructed by inscribing a groove in an insulating substrate. The LED chips are mounted in the groove and the leads are connected to metal plates, which wrap around the substrate to provide bottom contacts for surface-mounting.

Abstract: Thick metal plates are used both as leads and substrate of a laser diode package. The laser diode and the metal plate are covered with a sealing glue up to the outside end of the laser diode to form a unitary structure. The thick metal plates serve as a heat sink. The outside end of the laser diode is not covered with glue so that the emitted is not attenuated. A photo diode is used to monitor the emitted light intensity. The photo diode can share a common electrode with the laser diode by mounting the photo diode on a step-down metal plate, so that the light emitted from the inside end of the laser diode is only partially blocked.

Abstract: A focusing cup is directly glued to two or more preformed folded metal frames. Parts of the top surfaces of the folded metal frames contact the electrodes of semiconductor device placed inside the focusing cup. The bottoms of the metallic frames serve as the bottom contacts for surface mounting to a motherboard. The preformed metallic frames need not withstand the stress of folding and the package can be made thinner than prior art. The elimination of the through holes makes the package narrower. The bottoms of the metallic frames can be aligned one side of the bottom surface of the package, so that the package can be surface-mounted normally to or in parallel with a motherboard with light emitting respectively in parallel with or normally to the surface of the motherboard.

Abstract: The leads of a light emitting device package are extended is flexible pins. These pins can be bent with respect to a motherboard so that the direction of the light entitled from the light emitting device can be adjusted. The package is tab-mounted to the motherboard for heat sinking or serving as a lead.

Abstract: In a surface mount LED chips mounted on an insulating substrate, plated through conduits to interconnect the chips on both sides are placed at the corners of the outer terminals at two horizontal ends. The depressions caused by wire-bonding the chip to the terminals are lined up vertically with the corner conduits to reduce horizontal dimension.

Abstract: A mobile telephone uses a laser diode to indicate the presence of incoming telephone calls. The laser diode is energized by the incoming radio frequency (rf) signal by rectifying the rf signal to produce dc voltage. The antenna assembly has a transparent window for the emitted light to radiate. The emitted light passes through a patterned mask to generate artistic light rays. Using different kinds of semiconductor material for the laser diode, the laser diode can emit different colors.

Abstract: A plastic focusing cup is directly mounted on the bottom metallic contact plates for surface mounting of an optoelectric diode package.

Abstract: A light emitting diode (LED) is connected in series with the power supply input pad of an integrated circuit chip. The LED lights up when the power supply is turned on as an indicator that the IC is operating properly.

Abstract: Two flat contact pads form a portion of the bottom surface of a flat package and constitute the two external connections for the diode. The diode rests on at least one the contact pads. The diode and the contact pads are covered with protective glue. If the diode has one electrode at the bottom surface, the contact pad not in contact with diode is wire bonded to the top electrode. If the diode has both electrodes at the bottom surface, the two electrodes can rest on two separate contact pads. If the diode has both electrodes on the top surface, the electrodes can be wire-bonded to the two separate contact pads. The top surface of the contact pads can be roughened or protruded to increase adhesion between the protective glue and the contact pads. The contact pads can also have tunnels at the bottom surface to increase the gluing interface between the contact pads and the glue.

Abstract: A light emitting diode module is mounted perpendicular to a motherboard, so that the lights emit in a direction parallel to the motherboard. The bottom contacts of the module are lined up on only one side of the module. The contacts are soldered to the motherboard with substrate of the module in vertical position.