Patents Assigned to Harvatek Corportion
  • LED chip package structure using a substrate as a lampshade and method for making the same
    Patent number: 8002436
    Abstract: An LED chip package structure using a substrate as a lampshade includes a substrate unit and a light-emitting unit. The substrate unit has a substrate body with a lampshade shape. The light-emitting unit has a plurality of light-emitting elements electrically disposed on an inner surface of the substrate body. Therefore, one part of light beams projected by the light emitting elements is reflected out of the lampshade by the inner surface of the substrate body.
    Type: Grant
    Filed: October 1, 2008
    Date of Patent: August 23, 2011
    Assignee: Harvatek Corportion
    Inventors: Bily Wang, Shih-Yu Wu, Wen-Kuei Wu