Abstract: A tungsten film forming apparatus includes a reaction chamber, means for introducing WF.sub.6 into said reaction chamber, and means for introducing H.sub.2 gas into said reaction chamber, wherein at least the portion of at least said reaction chamber is made of the metal material whose surface is covered with the fluorinated paasivation film mainly consisting of the almost stoichiometric metal fluoride. It becomes possible to form a high quality tungsten film at a low substrate temperature by use of said tungsten film forming apparatus.