Abstract: The wire sawing device includes two external wire guide cylinders (1, 2) having a diameter (D1) smaller than that (D2) of the two internal wire guide cylinders (3, 4). The external wire guide cylinders are driven in rotation by a power drive to cause the movement of the wires of a layer of wires (6), whilst the internal wire guide cylinders (3, 4) ensure only the function of guidance without driving the wires of the layer of wires. By the separation of the drive function from the guide function of the wire, substantial heating of the guiding wire guide cylinders can be avoided, which permits obtaining sawed pieces of high precision without undulations.