Abstract: A photosensitive resin composition comprising (A) a polyimide precursor having a polymerizable unsaturated bond; (B) a polymerizable monomer; (C) a photopolymerization initiator; and (D) an ultraviolet absorber.

Abstract: A photosensitive resin composition of the invention contains (A) a polyimide precursor having a polymerizable unsaturated bond, (B) a photopolymerization initiator comprising a compound represented by the formula (11), (C) a thermal radical generator, and (D) a solvent containing ?-butyrolactone: wherein in the formula (11), R11 is a substituted or unsubstituted benzoyl group, a substituted or unsubstituted fluorenyl group, or a group comprising a substituted or unsubstituted carbazolyl group; R12 is an alkyl group including 1 to 12 carbon atoms, a group comprising a cycloalkyl group including 4 to 10 carbon atoms, a group comprising a phenyl group, or a group comprising a tolyl group; R13 is a substituted or unsubstituted aromatic hydrocarbon group including 6 to 20 carbon atoms.

Abstract: A photosensitive resin composition comprises a polyimide precursor having a polymerizable unsaturated bond; one or more compounds represented by any of the following formulas (1) to (4); and photopolymerization initiator represented by the following formula (11). In formulas (1) to (4), R1, R2, and R8 are independently an alkyl group including 1 to 4 carbon atoms, and R3 to R7 are independently a hydrogen atom, or an alkyl group including 1 to 4 carbon atoms; and in the formula (11), R11 is an alkyl or alkoxy group including 1 to 12 carbon atoms, a cycloalkyl group including 4 to 10 carbon atoms, a phenyl group, or a tolyl group; R12 is an alkyl group including 1 to 12 carbon atoms, a cycloalkyl group including 4 to 10 carbon atoms, a phenyl group, or a tolyl group; and R13 is a benzoyl group, a fluorenyl group, or a carbazolyl group.

Abstract: A method for producing a polyimide precursor having a structural unit represented by the following formula (1), comprising the following steps (i) and (ii), wherein at least one of the steps of (i) and (ii) is carried out in a solvent comprising a compound having an ether bond and an amide bond: (i) a step of reacting carboxylic anhydride with a diamine compound to obtain a polyimide precursor having a structural unit represented by the following formula (2); and (ii) a step of reacting the polyimide precursor having a structural unit represented by the formula (2) with a compound represented by the following formula (8), and reacting the reactant with a compound represented by the following formula (9) to obtain a polyimide precursor having a structural unit represented by the following formula (1): wherein in the formula (1), at least one of R1 and R2 is a group represented by the formula (3):

Abstract: A positive-type photosensitive resin composition comprises a (a) polybenzoxazole precursor, a (b) crosslinking agent, a (c) photosensitive agent, and a (d) solvent, wherein the (a) polybenzoxazole precursor comprises a structure represented by Formula (1) below, and the (c) photosensitive agent is a compound comprising a structure represented by Formula (2) below. In Formula (1), U is a bivalent organic group, a single bond, —O—, or —SO2—, V is a group comprising an aliphatic structure, and the carbon number in the aliphatic structure is 1 to 30.

Abstract: A positive-type photosensitive resin composition comprises a (a) polybenzoxazole precursor, a (b) crosslinking agent, a (c) photosensitive agent, and a (d) solvent, wherein the (a) component comprises a structural unit represented by Formula (1) below, and the (b) component is a compound represented by Formula (2) below. In Formula (1), U is a bivalent organic group, a single bond, —O—, or —SO2—, V is a group comprising an aliphatic structure, and the carbon number in the aliphatic structure is 1 to 30. In Formula (2), R1 is independently a hydrogen atom or a group represented by —CH2—O—R2. At least one of the plurality of R1s is a group represented by —CH2—O—R2. R2 is independently a hydrogen atom or an alkyl group having 1 to 6 carbon atoms.

Abstract: A photosensitive resin composition comprising (A) a polyimide precursor having a polymerizable unsaturated bond; (B) a polymerizable monomer having an aliphatic cyclic skeleton; (C) a photopolymerization initiator; and (D) a solvent.

Abstract: A photosensitive resin composition comprising the following component (a), component (b1), and component (b2). (a) a polyimide precursor having a structural unit represented by the following formula (1); (b1) one or more compounds selected from the group consisting of a compound represented by the following formula (11) and a compound represented by the following formula (12); (b2) one or more compounds selected from the group consisting of a compound represented by the following formula (21) and a compound represented by the following formula (22).

Abstract: A positive photosensitive resin composition comprising (a) polybenzoxazole precursor, (b) a cross-linking agent, (c) a diazonaphoquinone compound, (d) an iodonium compound and (e) a solvent.

Abstract: Provided is a photosensitive resin composition containing; (A) a polymer having an acidic functional group or a substituent derived therefrom; (B) a photoreactive compound; (C) a solvent; and (D) a nitrogen-containing aromatic compound represented by the following general formula (1).