Patents Assigned to Headway Technolog
  • Patent number: 6775903
    Abstract: A method for forming top and bottom spin valve sensors and the sensors so formed, the sensors having a strongly coupled SyAP pinned layer and an ultra-thin antiferromagnetic pinning layer. The two strongly coupled ferromagnetic layers comprising the SyAP pinned layer in the top valve configuration are separated by a Ru spacer layer approximately 3 angstroms thick, while the two layers in the bottom spin valve configuration are separated by a Rh spacer layer approximately 5 angstroms thick. This allows the use of an ultra thin MnPt antiferromagnetic pinning layer of thickness between approximately 80 and approximately 150 angstroms. The sensor structure produced thereby is suitable for high density applications.
    Type: Grant
    Filed: September 17, 2001
    Date of Patent: August 17, 2004
    Assignee: Headway Technolog
    Inventors: Cheng T. Horng, Kochan Ju, Mao-Min Chen, Min Li, Ru-Ying Tong, Simon Liao