Abstract: Apparatus for sputter depositing two or more layers of material onto a substrate in one operation includes an evacuable chamber containing a transport mechanism, substrate support, and at least two deposition units situated proximate the support. The transport mechanism moves the substrate to and from the support. When at the support, the substrate is passed by one deposition unit and then the other for sputter deposition of a thin film of material by each unit.
Abstract: Apparatus for sputter depositing two or more layers of material onto a substrate in one operation includes an evacuable chamber containing a transport mechanism, substrate support, and at least two deposition units situated proximate the support. The transport mechanism moves the substrate to and from the support. When at the support, the substrate is passed by one deposition unit and then the other for sputter deposition of a thin film of material by each unit.