Patents Assigned to Heat Technologies, Inc.
  • Patent number: 11353263
    Abstract: A drying apparatus can include, in some aspects, an ultrasonic transducer and an infrared heater positioned proximate to the ultrasonic transducer and configured to emit infrared light. The drying apparatus can include a plurality of ultrasonic transducers. The drying apparatus can include a delivery enclosure defining a bottom wall, the bottom wall defining a plurality of air outlets; the ultrasonic transducer mounted to the delivery enclosure; and the drying apparatus can include an air mover mounted to the delivery enclosure.
    Type: Grant
    Filed: August 11, 2020
    Date of Patent: June 7, 2022
    Assignee: Heat Technologies, Inc.
    Inventor: Zinovy Plavnik
  • Patent number: 10775104
    Abstract: Disclosed is an apparatus for drying a material, the apparatus including: an air-delivery enclosure with an air inlet and an air outlet through which forced air is directed toward the material; and an ultrasonic transducer connected to the air outlet of the air-delivery enclosure, the ultrasonic transducer including: a first inner surface; a second inner surface, the second inner surface facing the first inner surface, the first inner surface and the second inner surface defining an airflow path through the ultrasonic transducer; a first groove defined in a first inner surface, the first groove including a first flat portion; and a second groove defined in a second inner surface, the second groove including a second flat portion.
    Type: Grant
    Filed: June 25, 2018
    Date of Patent: September 15, 2020
    Assignee: Heat Technologies, Inc.
    Inventor: Zinovy Plavnik
  • Patent number: 10488108
    Abstract: Disclosed is an acoustic head for indirectly drying a material, the acoustic head including at least one ultrasonic transducer facing the material, the material having a first side, and a second side, the second side opposite the first side, the second side defining a surface to be dried, the ultrasonic transducer positioned facing the first side; and an air delivery unit positioned facing the first side of the material.
    Type: Grant
    Filed: July 1, 2014
    Date of Patent: November 26, 2019
    Assignee: Heat Technologies, Inc.
    Inventors: Zinovy Zalman Plavnik, Glenn Johnson Emory, Aliaksandr Hrynchuk, Jason Lye, Richard Terrell Sisk, Leonid Anatolyevich Volozhanin
  • Patent number: 10139162
    Abstract: An acoustic energy-transfer system includes: an acoustic chest arranged circumferentially around a container configured to receive a material to be processed; and an ultrasonic transducer arranged circumferentially inside the acoustic chest, the ultrasonic transducer defining an acoustic slot extending through the ultrasonic transducer, the acoustic slot angled with respect to a central axis of the acoustic chest.
    Type: Grant
    Filed: April 13, 2017
    Date of Patent: November 27, 2018
    Assignee: Heat Technologies, Inc.
    Inventors: Zinovy Zalman Plavnik, Jason Lye
  • Patent number: 10006704
    Abstract: Disclosed is an apparatus for drying a material, the apparatus including: an air-delivery enclosure with an air inlet and an air outlet through which forced air is directed toward the material; and an ultrasonic transducer connected to the air outlet of the air-delivery enclosure, the ultrasonic transducer including: a first inner surface; a second inner surface, the second inner surface facing the first inner surface, the first inner surface and the second inner surface defining an airflow path through the ultrasonic transducer; a first groove defined in a first inner surface, the first groove including a first flat portion; and a second groove defined in a second inner surface, the second groove including a second flat portion.
    Type: Grant
    Filed: April 28, 2015
    Date of Patent: June 26, 2018
    Assignee: Heat Technologies, Inc.
    Inventor: Zinovy Plavnik
  • Patent number: 9671166
    Abstract: An acoustic energy-transfer apparatus including: an acoustic chest, the acoustic chest defining an inner chamber sized to receive a material to be processed; and an acoustic device positioned within the acoustic chest and oriented to direct acoustic energy towards the material to be processed. A method for drying a material, the method including: positioning a material in an acoustic chest including an acoustic device; and directing acoustically energized air from the acoustic device at the material within the acoustic chest.
    Type: Grant
    Filed: July 24, 2015
    Date of Patent: June 6, 2017
    Assignee: Heat Technologies, Inc.
    Inventors: Zinovy Zalman Plavnik, Jason Lye
  • Patent number: 9068775
    Abstract: A drying apparatus and method including heated airflow and ultrasonic transducers. The ultrasonic transducers are arranged and operated for effectively breaking down the boundary layer to increase the heat transfer rate. The ultrasonic transducers are spaced from the material to be dried a distance of about (?)(n/4), where ? is the wavelength of the ultrasonic oscillations and n is an odd integer (i.e., 1, 3, 5, 7, etc.). In this way, the amplitude of the ultrasonic oscillations is maximized to more-effectively agitate the boundary layer. In addition, the ultrasonic transducers are operated to produce about 120-190 dB (preferably, about 160-185 dB) at the interface surface of the material to be dried. In one embodiment, the ultrasonic transducers are of a pneumatic type. In another embodiment, the ultrasonic transducers are of an electric type. And in other embodiments, infrared and/or UV light devices are included for further boundary layer disruption.
    Type: Grant
    Filed: February 9, 2009
    Date of Patent: June 30, 2015
    Assignee: Heat Technologies, Inc.
    Inventor: Zinovy Plavnik
  • Patent number: 7284596
    Abstract: A heat removal system includes a heatsink assembly having a base and a plurality of heat conducting folded fin members projecting from a first surface of the base and arranged to leave an open space on the first surface of the base. At least one thermally conductive slug projects from the center of the folded fin members and the folded fin members are thermally coupled to the slug. A gas circulating system is disposed over the slug and fin members projecting from the first surface of the base. The sidewall of a fin may be provided with at least one aperture. The top surface of the fin is closed, thereby permitting the fin to operate as a plenum of sorts. The bottom of the troughs may also be closed. The fins/troughs act as a plenum. A method of producing the folded fin heatsink member is also described.
    Type: Grant
    Filed: November 26, 2003
    Date of Patent: October 23, 2007
    Assignee: Heat Technology, Inc.
    Inventor: Ralph I. Larson
  • Patent number: 6827130
    Abstract: A heat removal system includes a heatsink assembly having a base and a plurality of heat conducting folded fin members projecting from a first surface of the base and arranged to leave an open space on the first surface of the base. At least one thermally conductive slug projects from the center of the folded fm members and the folded fin members are thermally coupled to the slug. A gas circulating system is disposed over the slug and fin members projecting from the first surface of the base. The sidewall of a fin may be provided with at least one aperture. The top surface of the fin is closed, thereby permitting the fin to operate as a plenum of sorts. The bottom of the troughs may also be closed. The fins/troughs act as a plenum. A method of producing the folded fin heatsink member is also described.
    Type: Grant
    Filed: June 4, 2002
    Date of Patent: December 7, 2004
    Assignee: Heat Technology, Inc.
    Inventor: Ralph I. Larson
  • Patent number: 6339875
    Abstract: A heatsink interface material for securing a heatsink to an integrated circuit includes a core material having an adhesive forced into opposing surfaces of the core material. It is preferred that an intermediate region of the core material be free of adhesive. In one embodiment, copper is deposited on the first and second surfaces of the core material and then nickel is deposited on the first and second surfaces. An exemplary method for fabricating a heatsink interface material in accordance with the present invention can include applying heat and pressure to force adhesive into the core material. Copper and nickel can be deposited on the core material surfaces using electroless deposition techniques.
    Type: Grant
    Filed: March 9, 2000
    Date of Patent: January 22, 2002
    Assignee: Heat Technology, Inc.
    Inventor: Ralph I. Larson
  • Patent number: 5774336
    Abstract: A thermally efficient circuit board has a base layer with high thermal conductivity and a thermal expansion coefficient close to that of silicon, such as aluminum silicon carbide. Above the base layer is a layer of anodized metal, either a separate material, such as aluminum, which is formed on the base and then anodized, or an anodized portion of the base itself. To the anodized metal is then applied a sealant material of lower thermal conductivity, but good electrically insulative and adhesive qualities, such as Teflon FEP. The sealant flows into cavities in the porous anodized metal structure, creating a well-anchored bond. A metal foil layer is then bonded to the surface of the sealant, and used to pattern conductive circuit paths using conventional methods.
    Type: Grant
    Filed: September 13, 1996
    Date of Patent: June 30, 1998
    Assignee: Heat Technology, Inc.
    Inventor: Ralph I. Larson
  • Patent number: 5687062
    Abstract: A thermally efficient circuit board has a base layer with high thermal conductivity and a thermal expansion coefficient close to that of silicon, such as aluminum silicon carbide. Above the base layer is a layer of anodized metal, either a separate material, such as aluminum, which is formed on the base and then anodized, or an anodized portion of the base itself. To the anodized metal is then applied a sealant material of lower thermal conductivity, but good electrically insulative and adhesive qualities, such as Teflon FEP. The sealant flows into cavities in the porous anodized metal structure, creating a well-anchored bond. A metal foil layer is then bonded to the surface of the sealant, and used to pattern conductive circuit paths using conventional methods.
    Type: Grant
    Filed: February 20, 1996
    Date of Patent: November 11, 1997
    Assignee: Heat Technology, Inc.
    Inventor: Ralph I. Larson
  • Patent number: 5622123
    Abstract: A process and apparatus for sterilizing soil includes an implement including a plurality of subsurface tools having hot water nozzles mounted thereon and connected to a source of hot water. Hot water is injected into the top layer of soil as the implement is moved over a field. Stirrer tools are mounted on the implement rearwardly of the subsurface tools and extend into the ground for mixing the soil and hot water to thereby provide a uniform temperature to the soil. A foam applying system applies an insulating foam to the surface of the soil immediately after the injection of hot water into the soil.
    Type: Grant
    Filed: August 10, 1995
    Date of Patent: April 22, 1997
    Assignee: Aqua Heat Technology, Inc.
    Inventor: A.H.J. Rajamannan
  • Patent number: 5287818
    Abstract: A method of killing soil pathogens to improve the agricultural production of a field comprises the steps of moving a plurality of agricultural tools through the soil and during this movement emitting microwave energy into the soil at a frequency within the range of 2GH.sub.z to 12GH.sub.z. The microwave energy heats the soil organisms to levels sufficient to kill the organisms.
    Type: Grant
    Filed: May 11, 1993
    Date of Patent: February 22, 1994
    Assignee: Aqua Heat Technology Inc.
    Inventor: A. H. J. Rajamannan