Patents Assigned to Heatron, Inc.
-
Publication number: 20120006517Abstract: A thermally conductive sleeve is disclosed which is used to heat a wide range of components. The sleeve can be used in conjunction with one or more heating elements to provide a heating system. Also described are various methods of using the sleeves and heating systems and forming the sleeves and heating systems.Type: ApplicationFiled: July 5, 2011Publication date: January 12, 2012Applicant: Heatron, Inc.Inventors: Keith Baird, Craig Riggs, Jeffrey A. Martin
-
Publication number: 20110309067Abstract: Electrically conductive traces, circuits, and devices such as heaters using such are described. Also described are various methods of forming the electrically conductive traces and circuits.Type: ApplicationFiled: June 16, 2011Publication date: December 22, 2011Applicant: Heatron, Inc.Inventor: Matthew J. Krussow
-
Patent number: 7997763Abstract: A light emitting diode (LED) lighting device that includes a housing and a heat sink assembly received within the housing. The heat sink assembly includes at least a first heat sink member and at least a second heat sink member. A printed circuit board having at least one LED provided thereon is mounted to both the first heat sink member and the second heat sink member. At least one biasing member biases an outer side of the first heat sink member and an outer side of the second heat sink member into contact with an inner side of the housing. Heat from the at least one LED is transferred through the heat sink assembly to the housing, where it is dissipated into the air.Type: GrantFiled: March 31, 2009Date of Patent: August 16, 2011Assignee: Heatron, Inc.Inventors: Richard N. Giardina, G. James Deutschlander, Brian S. Fetscher, Andrey Y. Sadchikov, Henrick A. Zabawski
-
Publication number: 20100246178Abstract: A light emitting diode (LED) lighting device that includes a housing and a heat sink assembly received within the housing. The heat sink assembly includes at least a first heat sink member and at least a second heat sink member. A printed circuit board having at least one LED provided thereon is mounted to both the first heat sink member and the second heat sink member. At least one biasing member biases an outer side of the first heat sink member and an outer side of the second heat sink member into contact with an inner side of the housing. Heat from the at least one LED is transferred through the heat sink assembly to the housing, where it is dissipated into the air.Type: ApplicationFiled: March 31, 2009Publication date: September 30, 2010Applicant: Heatron, Inc.Inventors: Richard N. Giardina, G. James Deutschlander, Brian S. Fetscher, Andrey Y. Sadchikov, Henrick A. Zabawski
-
Publication number: 20070257274Abstract: A lighting device having a light emitting diode (LED). The device includes a metal substrate having a surface. A dielectric coating layer is superimposed on the surface of the metal substrate. A light emitting diode (LED) is supported on the dielectric coating layer. The metal substrate serves as a heat sink for the heat emitted by LED during operation.Type: ApplicationFiled: November 27, 2006Publication date: November 8, 2007Applicant: Heatron, Inc.Inventors: Robert Martter, Craig Sundberg, Richard Giardina, Brian Fetscher, G. Deutschlander
-
Publication number: 20070102710Abstract: A lighting device having a light emitting diode (LED). The device includes a metal substrate having a surface. A dielectric coating layer is superimposed on the surface of the metal substrate. A light emitting diode (LED) is supported on the dielectric coating layer. The metal substrate serves as a heat sink for the heat emitted by LED during operation.Type: ApplicationFiled: November 27, 2006Publication date: May 10, 2007Applicant: Heatron, Inc.Inventors: Robert Martter, Craig Sundberg, Richard Giardina, Brian Fetscher, G. Deutschlander
-
Patent number: 6856157Abstract: The present invention provides a new electronic circuit board and a method of using such board to test electronic devices at elevated temperatures. The board comprises a steel base having a dielectric coating layer and a circuit formed on the layer. The circuit includes a connector region for attachment to an external electrical source and a mounting region for mounting sockets for supporting, powering and monitoring the electronic devices during elevated temperature testing. The board displays a leakage current of less than 10 ?Amps at 350° C.Type: GrantFiled: March 5, 2004Date of Patent: February 15, 2005Assignee: Heatron, Inc.Inventors: Robert H. Martter, Craig C. Sundberg, Richard N. Giardina, Brian S. Fetscher, G. James Deutschlander
-
Publication number: 20040169522Abstract: The present invention provides a new electronic circuit board and a method of using such board to test electronic devices at elevated temperatures. The board comprises a steel base having a dielectric coating layer and a circuit formed on the layer. The circuit includes a connector region for attachment to an external electrical source and a mounting region for mounting sockets for supporting, powering and monitoring the electronic devices during elevated temperature testing. The board displays a leakage current of less than 10 &mgr;Amps at 350° C.Type: ApplicationFiled: March 5, 2004Publication date: September 2, 2004Applicant: Heatron, Inc.Inventors: Robert H. Martter, Craig C. Sundberg, Richard N. Giardina, Brian S. Fetscher, G. James Deutschlander
-
Patent number: 6720784Abstract: An electric circuit board to test electronic devices at elevated temperatures. The board comprises a steel base having a dielectric coating layer and a circuit formed on the layer. The circuit includes a connector region for attachment to an external electrical source and a mounting region for mounting sockets for supporting, powering and monitoring the electronic devices during elevated temperature testing. The board displays a leakage current of less than 10&mgr; Amps at 350° C.Type: GrantFiled: June 19, 2002Date of Patent: April 13, 2004Assignee: Heatron, Inc.Inventors: Robert H. Martter, Craig C. Sundberg, Richard N. Giardina, Brian S. Fetscher, G. James Deutschlander
-
Patent number: 6617520Abstract: A circuit device and a method for providing an interface between a circuit device comprised of a porcelain enameled metal substrate and an external electrical conductor such as a wire or a lead. An aperture is formed in the substrate at the location where the connection is desired. An eyelet is then placed in the aperture. Crimping or other means are used to form a mechanical connection to the substrate and causes the eyelet to be retained in the aperture. The wire or lead of an electronic component is then inserted into the eyelet. The wire or lead is then soldered to the eyelet providing a joint of high mechanical strength.Type: GrantFiled: August 30, 2000Date of Patent: September 9, 2003Assignee: Heatron, Inc.Inventors: Robert H. Martter, Craig C. Sundberg, Richard N. Giardina, Brian S. Fetscher, G. James Deutschlander
-
Patent number: 6147331Abstract: A band heater includes a shoe assembly comprising a plurality of arcuate shoe segments each having a pair of outwardly-projecting extensions and a channel segment formed between the extensions. A strap assembly generally encircles the shoe assembly for retaining same in a circular configuration on an object to be heated. The strap assembly includes opposite side edges which are captured in slots formed by the shoe segment extensions. The strap assembly is thus retained generally within a continuous, annular channel formed by the shoe assembly. The strap assembly side edges can slide longitudinally within the shoe segment extension slots whereby relative movement, for example, due to thermal expansion and contraction, is accommodated. A thermal control unit, such as a tubular electric resistance heater, is located generally within the shoe assembly for conductivity heating same and is generally covered by the strap assembly.Type: GrantFiled: July 29, 1999Date of Patent: November 14, 2000Assignee: Heatron, Inc.Inventors: Christopher G. Still, Thomas A. Bothwell
-
Patent number: 5136143Abstract: An improved cartridge heater comprising a electrical resistance heating wire coil enclosed in a stainless steel cylindrical sheath and having bonded thereto a coating containing a solid lubricant and a binder. The solid lubricant providing for ease of removal of the cartridge heater from a bore hole into which it has been inserted for use and providing a barrier to corrosion between the cartridge heater and the metal of the apparatus in which the bore hole is located.Type: GrantFiled: June 14, 1991Date of Patent: August 4, 1992Assignee: Heatron, Inc.Inventors: Samuel J. Kutner, Herman B. Turner, Jr.
-
Patent number: 4794228Abstract: A heater assembly includes a heater with an electrical resistance wire element bonded between first and second layers of silicone rubber insulation. First and second conductor plates each having inner and outer surfaces are clamped together with the heater between their inner surfaces. A resettable, thermostatic switch is mounted on the outer surface of one of the conductor plates and opens when the conductor plate reaches a predetermined temperature.Type: GrantFiled: August 25, 1986Date of Patent: December 27, 1988Assignee: Heatron, Inc.Inventor: Fred P. Braun, Jr.