Patents Assigned to Heatron, Inc.
  • Publication number: 20120006517
    Abstract: A thermally conductive sleeve is disclosed which is used to heat a wide range of components. The sleeve can be used in conjunction with one or more heating elements to provide a heating system. Also described are various methods of using the sleeves and heating systems and forming the sleeves and heating systems.
    Type: Application
    Filed: July 5, 2011
    Publication date: January 12, 2012
    Applicant: Heatron, Inc.
    Inventors: Keith Baird, Craig Riggs, Jeffrey A. Martin
  • Publication number: 20110309067
    Abstract: Electrically conductive traces, circuits, and devices such as heaters using such are described. Also described are various methods of forming the electrically conductive traces and circuits.
    Type: Application
    Filed: June 16, 2011
    Publication date: December 22, 2011
    Applicant: Heatron, Inc.
    Inventor: Matthew J. Krussow
  • Patent number: 7997763
    Abstract: A light emitting diode (LED) lighting device that includes a housing and a heat sink assembly received within the housing. The heat sink assembly includes at least a first heat sink member and at least a second heat sink member. A printed circuit board having at least one LED provided thereon is mounted to both the first heat sink member and the second heat sink member. At least one biasing member biases an outer side of the first heat sink member and an outer side of the second heat sink member into contact with an inner side of the housing. Heat from the at least one LED is transferred through the heat sink assembly to the housing, where it is dissipated into the air.
    Type: Grant
    Filed: March 31, 2009
    Date of Patent: August 16, 2011
    Assignee: Heatron, Inc.
    Inventors: Richard N. Giardina, G. James Deutschlander, Brian S. Fetscher, Andrey Y. Sadchikov, Henrick A. Zabawski
  • Publication number: 20100246178
    Abstract: A light emitting diode (LED) lighting device that includes a housing and a heat sink assembly received within the housing. The heat sink assembly includes at least a first heat sink member and at least a second heat sink member. A printed circuit board having at least one LED provided thereon is mounted to both the first heat sink member and the second heat sink member. At least one biasing member biases an outer side of the first heat sink member and an outer side of the second heat sink member into contact with an inner side of the housing. Heat from the at least one LED is transferred through the heat sink assembly to the housing, where it is dissipated into the air.
    Type: Application
    Filed: March 31, 2009
    Publication date: September 30, 2010
    Applicant: Heatron, Inc.
    Inventors: Richard N. Giardina, G. James Deutschlander, Brian S. Fetscher, Andrey Y. Sadchikov, Henrick A. Zabawski
  • Publication number: 20070257274
    Abstract: A lighting device having a light emitting diode (LED). The device includes a metal substrate having a surface. A dielectric coating layer is superimposed on the surface of the metal substrate. A light emitting diode (LED) is supported on the dielectric coating layer. The metal substrate serves as a heat sink for the heat emitted by LED during operation.
    Type: Application
    Filed: November 27, 2006
    Publication date: November 8, 2007
    Applicant: Heatron, Inc.
    Inventors: Robert Martter, Craig Sundberg, Richard Giardina, Brian Fetscher, G. Deutschlander
  • Publication number: 20070102710
    Abstract: A lighting device having a light emitting diode (LED). The device includes a metal substrate having a surface. A dielectric coating layer is superimposed on the surface of the metal substrate. A light emitting diode (LED) is supported on the dielectric coating layer. The metal substrate serves as a heat sink for the heat emitted by LED during operation.
    Type: Application
    Filed: November 27, 2006
    Publication date: May 10, 2007
    Applicant: Heatron, Inc.
    Inventors: Robert Martter, Craig Sundberg, Richard Giardina, Brian Fetscher, G. Deutschlander
  • Patent number: 6856157
    Abstract: The present invention provides a new electronic circuit board and a method of using such board to test electronic devices at elevated temperatures. The board comprises a steel base having a dielectric coating layer and a circuit formed on the layer. The circuit includes a connector region for attachment to an external electrical source and a mounting region for mounting sockets for supporting, powering and monitoring the electronic devices during elevated temperature testing. The board displays a leakage current of less than 10 ?Amps at 350° C.
    Type: Grant
    Filed: March 5, 2004
    Date of Patent: February 15, 2005
    Assignee: Heatron, Inc.
    Inventors: Robert H. Martter, Craig C. Sundberg, Richard N. Giardina, Brian S. Fetscher, G. James Deutschlander
  • Publication number: 20040169522
    Abstract: The present invention provides a new electronic circuit board and a method of using such board to test electronic devices at elevated temperatures. The board comprises a steel base having a dielectric coating layer and a circuit formed on the layer. The circuit includes a connector region for attachment to an external electrical source and a mounting region for mounting sockets for supporting, powering and monitoring the electronic devices during elevated temperature testing. The board displays a leakage current of less than 10 &mgr;Amps at 350° C.
    Type: Application
    Filed: March 5, 2004
    Publication date: September 2, 2004
    Applicant: Heatron, Inc.
    Inventors: Robert H. Martter, Craig C. Sundberg, Richard N. Giardina, Brian S. Fetscher, G. James Deutschlander
  • Patent number: 6720784
    Abstract: An electric circuit board to test electronic devices at elevated temperatures. The board comprises a steel base having a dielectric coating layer and a circuit formed on the layer. The circuit includes a connector region for attachment to an external electrical source and a mounting region for mounting sockets for supporting, powering and monitoring the electronic devices during elevated temperature testing. The board displays a leakage current of less than 10&mgr; Amps at 350° C.
    Type: Grant
    Filed: June 19, 2002
    Date of Patent: April 13, 2004
    Assignee: Heatron, Inc.
    Inventors: Robert H. Martter, Craig C. Sundberg, Richard N. Giardina, Brian S. Fetscher, G. James Deutschlander
  • Patent number: 6617520
    Abstract: A circuit device and a method for providing an interface between a circuit device comprised of a porcelain enameled metal substrate and an external electrical conductor such as a wire or a lead. An aperture is formed in the substrate at the location where the connection is desired. An eyelet is then placed in the aperture. Crimping or other means are used to form a mechanical connection to the substrate and causes the eyelet to be retained in the aperture. The wire or lead of an electronic component is then inserted into the eyelet. The wire or lead is then soldered to the eyelet providing a joint of high mechanical strength.
    Type: Grant
    Filed: August 30, 2000
    Date of Patent: September 9, 2003
    Assignee: Heatron, Inc.
    Inventors: Robert H. Martter, Craig C. Sundberg, Richard N. Giardina, Brian S. Fetscher, G. James Deutschlander
  • Patent number: 6147331
    Abstract: A band heater includes a shoe assembly comprising a plurality of arcuate shoe segments each having a pair of outwardly-projecting extensions and a channel segment formed between the extensions. A strap assembly generally encircles the shoe assembly for retaining same in a circular configuration on an object to be heated. The strap assembly includes opposite side edges which are captured in slots formed by the shoe segment extensions. The strap assembly is thus retained generally within a continuous, annular channel formed by the shoe assembly. The strap assembly side edges can slide longitudinally within the shoe segment extension slots whereby relative movement, for example, due to thermal expansion and contraction, is accommodated. A thermal control unit, such as a tubular electric resistance heater, is located generally within the shoe assembly for conductivity heating same and is generally covered by the strap assembly.
    Type: Grant
    Filed: July 29, 1999
    Date of Patent: November 14, 2000
    Assignee: Heatron, Inc.
    Inventors: Christopher G. Still, Thomas A. Bothwell
  • Patent number: 5136143
    Abstract: An improved cartridge heater comprising a electrical resistance heating wire coil enclosed in a stainless steel cylindrical sheath and having bonded thereto a coating containing a solid lubricant and a binder. The solid lubricant providing for ease of removal of the cartridge heater from a bore hole into which it has been inserted for use and providing a barrier to corrosion between the cartridge heater and the metal of the apparatus in which the bore hole is located.
    Type: Grant
    Filed: June 14, 1991
    Date of Patent: August 4, 1992
    Assignee: Heatron, Inc.
    Inventors: Samuel J. Kutner, Herman B. Turner, Jr.
  • Patent number: 4794228
    Abstract: A heater assembly includes a heater with an electrical resistance wire element bonded between first and second layers of silicone rubber insulation. First and second conductor plates each having inner and outer surfaces are clamped together with the heater between their inner surfaces. A resettable, thermostatic switch is mounted on the outer surface of one of the conductor plates and opens when the conductor plate reaches a predetermined temperature.
    Type: Grant
    Filed: August 25, 1986
    Date of Patent: December 27, 1988
    Assignee: Heatron, Inc.
    Inventor: Fred P. Braun, Jr.