Patents Assigned to HEBI Robotics
  • Patent number: 11566888
    Abstract: Systems and methods are provided for collecting measurement data for a three-dimensional object. In embodiments, a computer model of the three-dimensional object is generated that correlates points on the three-dimensional object with points in three-dimensional space; the computer model is used to collect measurement data of the three-dimensional object and associate the collected measurement data with points in three-dimensional space; and a plan view computer model of the three-dimensional object is generated that depicts the measurement data in two dimensions and that associates the depicted measurement data with points in three-dimensional space.
    Type: Grant
    Filed: September 17, 2020
    Date of Patent: January 31, 2023
    Assignee: HEBI Robotics
    Inventor: David Rollinson