Abstract: The invention relates to an evaporative cooler having two medium circuits which are thermally coupled to one another by a number of heat-conducting vertical walls. These walls and the heat-conducting fins arranged thereon are provided with a hydrophilic, water-buffering covering layer, for example made from Portland cement. A humidification unit for moistening the covering layer is added to the dew point cooler. According to the invention, the humidification unit comprises a releasable cover which forms part of the casing of the dew point cooler and bears at least one sprinkler or nozzle for distributing water over the covering layer.