Patents Assigned to HEFEI BOE PIXEY TECHNOLOGY CO., LTD.
  • Publication number: 20240103316
    Abstract: An array substrate comprises: a device region; and a peripheral region; the device region and the peripheral region each comprise a substrate, and a reflective layer; the device region comprises an interlayer dielectric layer and a plurality of devices, and the interlayer dielectric layer is at least located between the substrate and the reflective layer; the reflective layer has a plurality of hollow regions along the direction perpendicular to the substrate, and the devices are located in the hollow region; the orthographic projection of the portion of the reflective layer located in the device region onto the substrate partially overlaps with the orthographic projection of the interlayer dielectric layer onto the substrate, the portion of the reflective layer covers the portion of the substrate located in the peripheral region, and the outer contour of the substrate is consistent with the outer contour of a peripheral region of the array substrate.
    Type: Application
    Filed: July 1, 2022
    Publication date: March 28, 2024
    Applicants: HEFEI BOE PIXEY TECHNOLOGY CO., LTD., BOE Technology Group Co., Ltd.
    Inventors: Liang Gao, Hai Tang