Patents Assigned to HEFEI SHENGDA ELECTRONICS TECHNOLOGY INDUSTRY CO., LTD.
  • Methods for partial gold plating of metal packaging housings and packaging housings thereof
    Patent number: 11725294
    Abstract: The present disclosure involves a method for partial gold plating of a metal packaging housing and a packaging housing thereof. The packaging housing may include a base. The base may be provided with at least one lead hole. A housing lead may be interspersed in the lead hole. The lead hole may be also provided with an insulator surrounding the housing lead. The method may include operations such as nickel plating, oxidation, gold plating, reduction, etc.
    Type: Grant
    Filed: October 21, 2022
    Date of Patent: August 15, 2023
    Assignee: HEFEI SHENGDA ELECTRONICS TECHNOLOGY INDUSTRY CO., LTD
    Inventors: Xiao Ma, Lei Yang, Huasan Chen, Zhengsheng Tang, Jin Sun, Bo Zhou, Minglong Wang
  • METHODS FOR PARTIAL GOLD PLATING OF METAL PACKAGING HOUSINGS AND PACKAGING HOUSINGS THEREOF
    Publication number: 20230175157
    Abstract: The present disclosure involves a method for partial gold plating of a metal packaging housing and a packaging housing thereof. The packaging housing may include a base. The base may be provided with at least one lead hole. A housing lead may be interspersed in the lead hole. The lead hole may be also provided with an insulator surrounding the housing lead. The method may include operations such as nickel plating, oxidation, gold plating, reduction, etc.
    Type: Application
    Filed: October 21, 2022
    Publication date: June 8, 2023
    Applicant: HEFEI SHENGDA ELECTRONICS TECHNOLOGY INDUSTRY CO., LTD.
    Inventors: Xiao MA, Lei YANG, Huasan CHEN, Zhengsheng TANG, Jin SUN, Bo ZHOU, Minglong WANG