Abstract: Disclosed herein is a technique of removing metal contained in a solution through chelation, which makes it possible to preclude undesired aggregation and permit effective aggregation through an aggregating process. A surface active agent containing a hydrophobic group, a hydrophilic group and a chelating group is added to the solution to be processed, and subsequently an aggregating process is carried out. The chelating group chelates metal, the hydrophilic group prevents undesired aggregation, and the hydrophobic group is effectively aggregated in the aggregating process. Various uses are possible by selecting the charge of ligand.
Type:
Grant
Filed:
August 30, 1996
Date of Patent:
September 9, 1997
Assignees:
Toyota Jidosha Kabushiki Kaisha, MEC International Corporation, Heijiro Ojima
Abstract: An apparatus for removing metal contained in a solution through chelation which includes a means for adding a surface active agent containing a hydrophobic group, a hydrophilic group and a chelating group to a metal containing solution held within a metal solution accommodating means. An electric field applying means is adapted to apply an electric field to the solution containing means and further means is provided for separating an aggregate from the metal contained solution.
Type:
Grant
Filed:
August 30, 1996
Date of Patent:
July 22, 1997
Assignees:
Toyota Jidosha Kabushiki Kaisha, Mec International Corporation, Heijiro Ojima
Abstract: Disclosed herein is a technique of removing metal contained in a solution through chelation, which makes it possible to preclude undesired aggregation and permit effective aggregation through an aggregating process. A surface active agent containing a hydrophobic group, a hydrophilic group and a chelating group is added to the solution to be processed, and subsequently an aggregating process is carried out. The chelating group chelates metal, the hydrophilic group prevents undesired aggregation, and the hydrophobic group is effectively aggregated in the aggregating process. Various uses are possible by selecting the charge of ligand.
Type:
Grant
Filed:
September 12, 1995
Date of Patent:
December 24, 1996
Assignees:
Toyota Jidosha Kabushiki Kaisha, MEC International Corporation, Heijiro Ojima