Patents Assigned to HELIOS APPLIED SYSTEMS PTE LTD
  • 3D mold for manufacturing of sub-micron 3D structures using 2-D photon lithography and nanoimprinting and process thereof
    Patent number: 9358737
    Abstract: A process to manufacture a 3D mold to fabricate a high-throughput and low cost sub-micron 3D structure product is disclosed. The process integrates use of 2-photon laser lithography and 3D write technology to make a 3D mold of each layer of the 3D structure product, and then use nanoimprinting to form a sheet of polymer film of each layer of the 3D structure from the said 3D mold of that layer. Each layer of the sheet of polymer film is then fabricated into the sub-micron 3D structure product. The 3D mold of each layer of a high-throughput and low cost sub-micron 3D structure product, is further used to make master molds which is then used to form a sheet of polymer film of each layer of the 3D structure to fabricate the sub-micron 3D structure product. Applications using this process are also disclosed.
    Type: Grant
    Filed: November 23, 2009
    Date of Patent: June 7, 2016
    Assignee: HELIOS APPLIED SYSTEMS PTE LTD
    Inventor: Shyi-Herng Kan
  • 3D mold for manufacturing of sub-micron 3D structures using 2-D photon lithography and nanoimprinting and process thereof
    Patent number: 9272474
    Abstract: A process to manufacture a 3D mold to fabricate a high-throughput and low cost sub-micron 3D structure product is disclosed. The process integrates use of 2-photon laser lithography and 3D write technology to make a 3D mold of each layer of the 3D structure product, and then use nanoimprinting to form a sheet of polymer film of each layer of the 3D structure from the said 3D mold of that layer. Each layer of the sheet of polymer film is then fabricated into the sub-micron 3D structure product. The 3D mold of each layer of a high-throughput and low cost sub-micron 3D structure product, is further used to make master molds which is then used to form a sheet of polymer film of each layer of the 3D structure to fabricate the sub-micron 3D structure product. Applications using this process are also disclosed.
    Type: Grant
    Filed: April 8, 2013
    Date of Patent: March 1, 2016
    Assignee: HELIOS APPLIED SYSTEMS PTE LTD
    Inventor: Shyi-Herng Kan
  • 3D Mold For Manufacturing Of Sub-Micron 3D Structures Using 2-D Photon Lithography And Nanoimprinting And Process Thereof
    Publication number: 20110046764
    Abstract: A process to manufacture a 3D mold to fabricate a high-throughput and low cost sub-micron 3D structure product is disclosed. The process integrates use of 2-photon laser lithography and 3D write technology to make a 3D mold of each layer of the 3D structure product, and then use nanoimprinting to form a sheet of polymer film of each layer of the 3D structure from the said 3D mold of that layer. Each layer of the sheet of polymer film is then fabricated into the sub-micron 3D structure product. The 3D mold of each layer of a high-throughput and low cost sub-micron 3D structure product, is further used to make master molds which is then used to form a sheet of polymer film of each layer of the 3D structure to fabricate the sub-micron 3D structure product. Applications using this process are also disclosed.
    Type: Application
    Filed: November 23, 2009
    Publication date: February 24, 2011
    Applicant: HELIOS APPLIED SYSTEMS PTE LTD
    Inventor: Shyi-Herng Kan