Abstract: An apparatus for thermal treatment of coatings on substrates includes a microwave applicator cavity; a microwave power supply to deliver power to the cavity; a thermally insulated microwave-transparent compartment within the cavity, large enough to contain the coated substrate while occupying no more than 50% of the total volume of the cavity; a means of supporting the coated substrate within the compartment; an adjustable IR heating source in the compartment and facing the substrate so that a selected amount of IR heating may be applied to the substrate; and, a non-contacting temperature measurement device to measure the temperature of the coating. Related methods for using the apparatus to process different kinds of films are also disclosed.

Abstract: A method of transporting an article through a processing housing while minimizing the loss of a controlled atmosphere from the process housing. This method includes the steps of placing an article on a first carriage member, then vertically displacing the article from the entry level through an entry opening of entry housing to a processing level. The article is then transferred from the first carriage member to an endless conveyor for transporting, horizontally, through the process housing. The article is then transferred to a second carriage member which moves the article vertically through a exit housing to and through an exit opening near an exit level. The processed article is then removed at the exit level. The vertical distance between the process level and the entry opening and the exit opening separates the controlled atmosphere from the ambient atmosphere exterior of the housings.

Abstract: A method for minimizing the clogging of a cooling zone heat exchanger of a reflow solder apparatus that includes the steps of: removing a gas/flux mixture from an exhaust zone (20) that is located adjacent a heated zone and/or a cooling zone; conducting the gas/flux mixture to and through a first filter chamber (22), conducting the filtered gas from the filter chamber (22) through a low pressure portion of a blower housing of a cooling zone (16), then subsequently to and through a high pressure portion (44) of the cooling zone that includes a collection tray (38), a mesh filter (48), a heat exchanger (46) and at least one perforated plate (50). The heat exchanger is thermostatically controlled at a preset tempering temperature that minimizes the collection of flux on its exterior surfaces while allowing a solder joint of an article to solidify.