Patents Assigned to Hello Direct
  • Patent number: 5369857
    Abstract: A telephone headset uses extruded thermoplastic with a pair of embedded steel wires to make the headband and microphone boom. The extrusion is formed by feeding the two wires through the extruding die along with the hot plastic. The two wires serve to stiffen the extrusion and also as electrical conductors. The material is cut to length and joined to earphones, microphones and telephone cable to make the headset; the two wires conduct the sound signals to the earphone distal the telephone cable attachment. The extrusion material retains a twist, which allows for angular adjustment of the earphones. A hinge and spring cant the headphone inward at the bottom for greater comfort, and to adjust the angle to the user's head. In a second embodiment, one of the wires is removed after extrusion to leave a tunnel through the extruded material. Small electrical leads can be passed through the tunnel, and the remaining wire remains as a stiffener.
    Type: Grant
    Filed: December 8, 1992
    Date of Patent: December 6, 1994
    Assignee: Hello Direct
    Inventors: Jim Sacherman, John Toor
  • Patent number: D346802
    Type: Grant
    Filed: September 28, 1992
    Date of Patent: May 10, 1994
    Assignee: Hello Direct
    Inventors: Jim Sacherman, John Toor